Abstract: There is described an apparatus and method for deploying a sensor array comprising a plurality of sensors (5) joined together by connection cables (6) in one or more “chains”, and connected to an input/output device (8). An input/output connection unit (7, 15) is provided on a carrier (10), and the sensors are held on or in deployment devices (14a-14e) mounted to the carrier with their connection cables (6) connected to the input/output connection unit (7, 15). The input/output device (8) may also be mounted to the carrier, and connected to the connection unit (7, 15). The carrier (10), sensors, and input/output device (8) may be delivered as a single package to the area where the sensor array is to be deployed. The sensors are then moved from the carrier to their final positions. The deployment devices (14a-14e) may be detached from the carrier and moved sequentially to the sensor positions, and a sensor may be removed from the deployment device at each sensor position.

Abstract: There is described a method and apparatus for deploying and covering undersea seismic sensing cables to improve seismic coupling between the sensors of the cable and the seabed. The method comprises simultaneously deploying a submarine seismic cable and a mat in order to cover at least the sensor units of the cable. The mat may be attached to the cable prior to laying the cable on the seabed, and is preferably simultaneously laid with the cable by unwinding the cable and mat from a drum. The mat may be continuous, or may be in discrete sections attached to the cable at spaced locations.

Abstract: There is described an apparatus and method for deploying a sensor array comprising a plurality of sensors (5) joined together by connection cables (6) in one or more “chains”, and connected to an input/output device (8). An input/output connection unit (7, 15) is provided on a carrier (10), and the sensors are held on or in deployment devices (14a-14e) mounted to the carrier with their connection cables (6) connected to the input/output connection unit (7, 15). The input/output device (8) may also be mounted to the carrier, and connected to the connection unit (7, 15). The carrier (10), sensors, and input/output device (8) may be delivered as a single package to the area where the sensor array is to be deployed. The sensors are then moved from the carrier to their final positions. The deployment devices (14a-14e) may be detached from the carrier and moved sequentially to the sensor positions, and a sensor may be removed from the deployment device at each sensor position.