Abstract: A memory includes an array of resistive memory cells and circuitry for setting a write parameter for improving write effectiveness to the cells of the memory array. The circuitry performs a write parameter setting routine that determines a midpoint resistance of a memory state of cells of the array and determines a write efficiency of a weak write operation to cells of the array. Based on the determined midpoint resistance and the determined write efficiency, the circuit sets a write parameter level for subsequent writes to cells of the array.

Abstract: A memory includes an array of resistive memory cells and circuitry for setting a write parameter for improving write effectiveness to the cells of the memory array. The circuitry performs a write parameter setting routine that determines a midpoint resistance of a memory state of cells of the array and determines a write efficiency of a weak write operation to cells of the array. Based on the determined midpoint resistance and the determined write efficiency, the circuit sets a write parameter level for subsequent writes to cells of the array.

Abstract: As disclosed herein, a non-volatile memory circuit includes an array of memory cells. The non-volatile memory circuit also includes circuitry for performing a hard write to selective bits of addressed cells simultaneously with a normal write to the other bits of the addressed cells during a write operation to the addressed cells.

Abstract: As disclosed herein, a non-volatile memory circuit includes an array of memory cells. The non-volatile memory circuit also includes circuitry for performing a hard write to selective bits of addressed cells simultaneously with a normal write to the other bits of the addressed cells during a write operation to the addressed cells.

Abstract: Embodiments of a magnetoresistive random access memory (MRAM) diagnostic system are provided, which includes: preconditioning all bit cells in an MRAM cell array to a data value of one during a diagnostic mode, wherein the MRAM cell array is implemented in an active side of a semiconductor substrate; applying a first magnetic disturb field having a predetermined field strength to the MRAM cell array, subsequent to the preconditioning, wherein the first magnetic disturb field is generated by an antenna implemented in a number of layers of conductive and dielectric material over the active side of the semiconductor substrate; performing a first error correcting code (ECC) read operation to read the MRAM cell array, subsequent to the applying the first magnetic disturb field; and in response to detecting at least one uncorrectable read during the first ECC read operation, setting a fail state and exiting the diagnostic mode.

Abstract: A technique for detecting an imminent read failure in a memory array includes determining whether a memory array, which does not exhibit an uncorrectable error correcting code (ECC) read during an initial array integrity check at a normal read verify voltage level, exhibits an uncorrectable ECC read during a subsequent array integrity check at a margin read verify voltage level. The technique also includes providing an indication of an imminent read failure for the memory array when the memory array exhibits an uncorrectable ECC read during the subsequent array integrity check. In this case, the margin read verify voltage level is different from the normal read verify voltage level.

Abstract: A technique for detecting an imminent read failure in a memory array includes determining a first incident count for a memory array that does not exhibit an uncorrectable error correcting code (ECC) read during an array integrity check. In this case, the first incident count corresponds to an initial number of ECC corrections that are performed when the array integrity check of the memory array initially fails. The technique also includes determining a current count for the memory array when the memory array does not exhibit an uncorrectable ECC read during subsequent array integrity checks. In this case, the current count corresponds to a subsequent number of error correcting code (ECC) corrections required during the subsequent array integrity checks. An indication of an imminent read failure for the memory array is provided when the current count exceeds the first incident count by a predetermined amount.

Abstract: A non-volatile memory can have multiple blocks erased in parallel for a relatively few number of erase operations. This saves time for the user in the set-up of the memory because the erase operation is relatively slow. Problems with parallel erase relate to different blocks having different program/erase histories with the result that the blocks with different histories erase differently. Thus, after a predetermined number of erase cycles are performed, the ability to parallel erase is prevented. This is achieved by allowing parallel erasing operations until the predetermined number of erase operations have been counted. After that predetermined number has been reached, a parallel erase mode disable signal is generated to prevent further parallel erase cycles. The count and the predetermined number are maintained in a small block of the non-volatile memory that is inaccessible to the user.

Abstract: A semiconductor device has a large number of bond pads on the periphery for wirebonding. The semiconductor device has a module as well as other circuitry, but the module takes significantly longer to test than the other circuitry. A relatively small number of the bond pads, the module bond pads, are required for the module testing due, at least in part, to the semiconductor device having a built-in self-test (BIST) circuitry. The functionality of these module bond pads is duplicated on the top surface of and in the interior of the semiconductor device with module test pads that are significantly larger than the bond pads on the periphery. Having large pads for testing allows longer probe needles, thus increasing parallel testing capability. Duplicating the functionality is achieved through a test pad interface so that the module bond pads and the module test pads do not have to be shorted together.