Patents by Inventor Richard Ewell

Richard Ewell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices
    Patent number: 5712448
    Abstract: A cooling device for lowering the temperature of a heat-dissipating device. The cooling device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with the heat-dissipating device. During operation, heat flows from the heat-dissipating device into the heat-conducting substrate, where it is spread out over a relatively large area. A thermoelectric cooling material (e.g., a Bi.sub.2 Te.sub.3 -based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. Application of electrical power to the thermoelectric material drives the thermoelectric material to pump heat into a second heat-conducting substrate which, in turn, is attached to a heat sink.
    Type: Grant
    Filed: February 7, 1996
    Date of Patent: January 27, 1998
    Assignee: California Institute of Technology
    Inventors: Ian W. Vandersande, Richard Ewell, Jean-Pierre Fleurial, Hylan B. Lyon