Patents by Inventor Richard Ewers

Richard Ewers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5977630
    Abstract: A plurality of semiconductor die, which may be of diverse size and diverse junction pattern, are fixed to a common lead frame and within a common package. The semiconductor die are mounted on respective main pad areas that are laterally spaced from one another and which have respective heat sinks. The heat sinks extend from the boundary of the device package and form external pins that are available for external connection at the same or at different potentials. Isolated pins are also provided. The device package may be used for high and low side chopper circuits, synchronous regulator circuits, single-mode bridges, and the like.
    Type: Grant
    Filed: August 15, 1997
    Date of Patent: November 2, 1999
    Assignee: International Rectifier Corp.
    Inventors: Arthur Woodworth, George Pearson, Peter Richard Ewer
  • Patent number: 5763949
    Abstract: A surface-mount semiconductor package comprises a semiconductor which is embedded within a plastic material body. Electrical control connections to the semiconductor package include first and second pads which are spaced apart from each other, making it easier to couple the devices in parallel. Power output is provided by metal pads. The pads may be partially sheared, to step them, thereby allowing a single thickness lead frame to be used in the manufacture of the device. On the lower face of the body there are channels which increase the electrical tracking distance and allow improved washing of residues after the device has been secured to a substrate.
    Type: Grant
    Filed: January 4, 1996
    Date of Patent: June 9, 1998
    Assignee: International Rectifier Corporation
    Inventors: Arthur Woodworth, Peter Richard Ewer
  • Patent number: 5760472
    Abstract: A surface-mount semiconductor package comprises a semiconductor which is embedded within a plastics material body (10). Electrical control connections to the semiconductor comprise first and second upstanding legs (12,14) which are offset from each other, making it easier to couple the devices in parallel. Power output is provided by metal pads (16,18). The pads may be partially sheared, to step them, thereby allowing a single thickness leadframe to be used in the manufacture of the device. On the lower face of the body (10) there are channels (22,24) which increase the electrical tracking distance and allow improved washing of residues after the device has been secured to a substrate.
    Type: Grant
    Filed: July 31, 1996
    Date of Patent: June 2, 1998
    Assignee: International Rectifier Corporation
    Inventors: Arthur Woodworth, Peter Richard Ewer