Abstract: A multispectral inspection (MSI) device for analyzing an electronic item having a printed circuit board (PCB). An electronic power supply powers the electronic item in accordance with one or more test vectors. An optical imaging scanner, terahertz (THz) imaging scanner, and a functional imaging scanner are each operative to scan the electronic item. An electronic processor is programmed to scan the various scanners and control the power supply to acquire optical, THz, and functional images of the electronic item. The images are combined to form a standard three-dimensional (3D) signature and artificial intelligence (AI) classifiers are applied to the 3D signature to perform non-destructive analyses of the electronic item.

Abstract: A spacer for interposition between adjacent balls in a ball bearing assembly is provided comprising a thermoplastically molded body having a cylindrical periphery and oppositely disposed ball engaging sides. An internal reinforcement disc formed from a material having a high specific heat is molded into the body. The internal reinforcement disc includes a circumferential flange that provides an initial compressive prestress on the thermoplastically molded body.