Abstract: The present invention is a vapor chamber including a housing that forms a recess within; at least one wicking structure manufactured from a bundle of wires having capillary voids therebetween that is disposed within the recess; and an amount of working fluid disposed within the recess and in fluid contact with the wicking structure such that fluid may move within the capillary voids in the wicking structures through capillary action.

Abstract: A heat sink, method of making a heat sink, and a heat sink assembly. The heat sink includes a base and a plurality of heat pipes that extend from the base. The base is dimensioned and shaped to promote good thermal contact with the heat source, and the heat pipes are attached thereto in such a manner as to promote good thermal contact to the working fluid. Each heat pipe includes an outer surface and an inner surface that form a condenser portion from which from heat is transferred during condensation of the working fluid.

Abstract: A semiconductor assembly comprising a flat disc-shaped semiconductor with terminals on opposite faces with an electrically conductive heat sink in electrical and thermal contact with each face. The semiconductor device and heat sinks are enclosed and maintained under compression by a rigid frame. The heat sinks are electrically insulated from each other and from the rigid frame by an insulating bond which secures these components together. Variations in compressive pressure holding the heat sinks in facing contact with the semiconductor device is compensated by a thermally responsive element positioned between each heat sink and the rigid frame in linear alignment with each other and the semiconductor device, whereby increases in temperature will expand the thermally responsive element to increase compression forces on the assembly of heat sinks and, semiconductor devices.

Abstract: A semiconductor element is positioned between opposing faces of two thermally and electrically conductive members. An external force is then applied to the two members to move the opposing faces of the members toward each other and against the sides of the element. While this external force is maintained, the members are fixed in a housing by means of bonding means, and are separated from the housing by an electrically insulating, thermally conducting material, which may itself be the bonding means. Upon removal of the external force from the members, the members are held by the bonding means and the housing in thermal and electrical contact with the semiconductor element, and the assembly has been pre-stressed. During the operation of the semiconductor element the pressure is controlled by thermally responsive elements.