Abstract: An improved filter assembly (10) for filtering RFI/EMI in printed circuit boards is disclosed, together with methods of manufacture thereof. A filter sleeve (16) is carried by an outer leg (11) of the filter assembly and is substantially parallel to the respective legs (11, 12, 13) thereof, thereby providing a compact structure for improved circuit miniaturization. The filter assemblies are encapsulated with a suitable insulating material (17). The respective filter assemblies (10) are made in a continuous strip, suitably stamped, and broken off as desired by the user. In a further embodiment, the respective filter assemblies are made from a continuous wire, suitably bent and formed, and cut off as desired.

Abstract: A continuous strip (200) of electrical component assemblies (22) is disclosed, together with method of manufacturing thereof. The components are made by stamping a metal strip to form an intermediate article having a plurality of first and second members (28, 38) integrally extending therefrom and joined thereto at spaced locations therealong. Each first member (28) has at least one second member (38) associated with and adjacent to it. The second members (38) include locating means (42) for enabling at least third members (56) to be assembled to the first members (28) in a precisely located relationship. The first members (28) may also include further locating means (37) for fourth members (46) to be included in the assembly. The strip thus provides its own fixturing means for precisely locating the various members of electronic component assemblies.