Patents by Inventor Richard F. Sutton, Jr.

Richard F. Sutton, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride
    Patent number: 5196500
    Abstract: Tetrapolyimide films derived from 3,3',4,4'-benzophenone tetracarboxylic dianhydride, pyromellitic acid dianhydride, p-phenylene diamine and 4,4'-diaminodiphenyl ether, and their preparation, are described. The tetrapolymer films have low water absorption, low coefficients of thermal and hygroscopic expansion, high modulus and are caustic etachable and can be used in flexible printed circuit and tape automated bonding applications.
    Type: Grant
    Filed: December 17, 1990
    Date of Patent: March 23, 1993
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: John A. Kreuz, Richard F. Sutton, Jr., Stuart N. Milligan
  • Copolyimide film with improved properties
    Patent number: 5166308
    Abstract: Disclosed is an aromatic copolyimide film prepared by chemical conversion of a copolyamide acid solution obtained by copolymerization of an aromatic tetracarboxylic acid component comprising from 30 to 50 mole % of biphenyltetracarboxylic acid dianhydride, 50 to 70 mole % of pyromellitic acid dianhydride, 60 to 80 mole % of p-phenylenediamine and 20 to 40 mole % of 4,4'-diaminodiphenyl ether. The aromatic copolyimide film has a low coefficient of thermal expansion, low water absorption, a low coefficient of hygroscopic expansion, high mechanical strength and is readily etchable making it suitable for use an advanced electronic substrate.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: November 24, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: John A. Kreuz, Richard F. Sutton, Jr.
  • Polyimide molecular weight enhancement by solvent extraction
    Patent number: 4906731
    Abstract: Extraction of polyamic acid-polyimide gel in bipolymerized polyimide manufacturing process with a solvent containing an extraction-enhancing agent, which is a pyridine, picoline, or quinoline, leads to a polyimide film having increased molecular weight. Polyimides are valuable materials used in fabricating articles which must withstand high temperatures, especially in aerospace applications, and in the manufacture of electronic circuit boards.
    Type: Grant
    Filed: June 1, 1987
    Date of Patent: March 6, 1990
    Assignee: E. I. Du Pont De Nemours and Company
    Inventor: Richard F. Sutton, Jr.
  • Process for preparing polyimides
    Patent number: 4742153
    Abstract: An improved process for preparing polyimides is disclosed which involves end capping intermediate polyamic acids with dicarboxylic acid monoanhydrides and thermally converting to high molecular weight polyimides.
    Type: Grant
    Filed: April 16, 1986
    Date of Patent: May 3, 1988
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Richard F. Sutton, Jr.
  • Polyimide manufacture
    Patent number: 4358581
    Abstract: A process is disclosed for manufacturing high molecular weight polyimide from a chilled solution which includes a polyamide acid prepolymer, a finishing component, and a converting system wherein, when the solution is heated, polyamide acid polymer is formed and converted to polyimide.
    Type: Grant
    Filed: December 5, 1980
    Date of Patent: November 9, 1982
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Richard F. Sutton, Jr.