Patents by Inventor Richard F. Vreeland

Richard F. Vreeland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming thin film resistor structures utilizing interconnect liner materials
    Patent number: 11201114
    Abstract: Methods/structures of forming thin film resistors using interconnect liner materials are described. Those methods/structures may include forming a first liner in a first trench, wherein the first trench is disposed in a dielectric layer that is disposed on a substrate. Forming a second liner in a second trench, wherein the second trench is adjacent the first trench, forming an interconnect material on the first liner in the first trench, adjusting a resistance value of the second liner, forming a first contact structure on a top surface of the interconnect material, and forming a second contact structure on the second liner.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Kevin Lin, Christopher J. Jezewski, Richard F. Vreeland, Tristan A. Tronic
  • METHODS OF FORMING THIN FILM RESISTOR STRUCTURES UTILIZING INTERCONNECT LINER MATERIALS
    Publication number: 20190326214
    Abstract: Methods/structures of forming thin film resistors using interconnect liner materials are described. Those methods/structures may include forming a first liner in a first trench, wherein the first trench is disposed in a dielectric layer that is disposed on a substrate. Forming a second liner in a second trench, wherein the second trench is adjacent the first trench, forming an interconnect material on the first liner in the first trench, adjusting a resistance value of the second liner, forming a first contact structure on a top surface of the interconnect material, and forming a second contact structure on the second liner.
    Type: Application
    Filed: December 29, 2016
    Publication date: October 24, 2019
    Applicant: Intel Corporation
    Inventors: Kevin Lin, Christopher J. Jezewski, Richard F. Vreeland, Tristan A. Tronic