Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole.

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole.

Abstract: An economical protective shield assembly of a dielectric substrate and an EMI shield, substantially free of the effects of board coupling and air coupling which requires less hardware for securing an EMI shield than present devices and methods, is provided for. The inventions use of simply finished shield edges with an unimproved substrate having a conductive intermediary interconnected with a grounding path and simply finished or unfinished shield edges with an improved substrate having a mating groove cooperatively adapted to fit the shield edge, interacts to exclude EMI signals and requires less precision in positioning the shield onto the substrate. The invention also provides a simplified method to exclude EMI effects for an assembly by a process of fabrication requiring less finishing steps than present processes.

Abstract: A bracket mount for precise antenna adjustment includes a lever or mechanical assist to permit slight movements to the antenna simply by manipulating the lever. The adjustable lever may be a built-in cam or yoke, or may be removably attached to the mount and antenna by an anchoring screw which acts to secure the antenna in place once the desired direction is achieved. The bracket mount may further include two adjusting levers, one for adjusting antenna direction in an up/down direction, and the other for adjusting the antenna in a left/right direction.

Abstract: A protective enclosure for housing heat-generating electronics, having a sorption device for controlling humidity and a heater for heating the sorption device. The invention protects electronics placed within the enclosure from the effects of water vapor and condensation during normal operation and in the event of power loss. The sorption device adsorbs water vapor during normal operation or power loss when the temperature in the enclosure falls below the dew point. The sorption device releases collected water as water vapor when power is restored and the temperature in the enclosure rises above the dew point. The invention thereby prevents failure of the electronics due to condensation build-up and provides for effective long-term use of the sorption device.