Abstract: An apparatus (10) is disclosed including a friction clutch (12) and an overload apparatus (14) connected in parallel between an input (16) and an output (18). Encoders (20, 22) are provided for separately detecting the rotational positions of the input (16) and the output (18). A microcomputer controller (580) controls actuation of the friction clutch (12) and the overload apparatus (14) in response to the rotational positions detected by the encoders (20, 22) allowing the clutch (12) to bring the output (18) to be generally aligned with a select rotational position of the input (16) at which time the overload apparatus (14) can be actuated to rotatably relate the input (16) and the output (18) at the select rotational position and actuation of the clutch (12) can be removed. The microcomputer controller (580) also removes actuation of the overload apparatus (14) when the encoders (20, 22) detect rotation of the input (16) relative to the output (18) from the select rotational position.

Abstract: A torque and/or rotational control apparatus is disclosed in a preferred form of a brake (10) including a plurality of pairs of actuators (18) positioned on opposite sides of a friction disc (16) by spacers (120) having tear shaped cross sections. The pads (32) of the actuators (18) are removably held by a slideable locking pin (70) biased by a spring (80) into an aperture (68) of a backing plate (62) for the pad (32). A notch (64) formed in the pad (32) and the backing plate (62) is slideably received on a rail (66) axially extending from the housing (35) of the actuator (18) to prevent rotation about the locking pin (70). The friction disc (16) includes elongated and shortened fins (42, 43) upstanding between and equally circumferentially spaced intermediate first and second component discs (40, 41). The fins (42, 43) are free of circumferential interconnections to allow air to radially pass freely between the fins (42, 43).

Abstract: A wafer transfer apparatus used in manufacturing high density semiconductor products is disclosed which includes at least three movable arms for supporting a wafer from below thereby preventing contact with the active surface of the wafer. A mechanism for moving the arms into and out of its wafer supporting position is diposed, in part, above the wafer when a wafer is supported thereby. The portions of the actuator mechanism disposed above the wafer are constructed in a way such that no sliding contact occurs between elements thereof. Sliding contact between elements disposed above a wafer has proved to produce microscopic particles which can fall onto the active surface of the wafer thereby contaminating the circuits contained thereon. As sliding contact is avoided by the apparatus of the present invention, contamination particles produced within the wafer transfer apparatus is substantially reduced, if not entirely eliminated.

Abstract: This invention concerns method and apparatus for making a mask conforming to a cured MLC substrate. The mask when made may be used to add layers of metallization to the cured substrate by conventional photolithographic techniques. The method and apparatus feature use of the cured substrate itself to pattern the mask. Particularly, the substrate is aligned with the unpatterned mask and the image of the substrate transferred to the mask such that once patterned, the mask may subsequently be realigned with the substrate. In preferred form, a system of notches and grooves are used to align the substrate and mask and a lens system used to transfer the substrate image to the mask. The invention also includes method and apparatus for making an improved MLC substrate. The improvement is characterized by the use of photolithographic techniques to add successive layers of metallization to the cured substrate.

Abstract: There is disclosed a method of selectively metallizing a ceramic substrate provided with a metallization pattern according by photoresist processing. A first layer of photoresist is blanket deposited over the substrate exposed through a coarse block out mask, and developed in order to protect those areas of the metallization pattern not to be covered with metal. A blanket metal layer is then formed over the entire substrate surface. A second layer of photoresist is deposited, exposed through a customized mask of the metallization pattern, and developed. The exposed metal is etched and the remaining first and second photoresist layers are removed, leaving a coating of metal only at desired locations.The method may be used for the heavy gold deposition over the Engineering change pads used as a standard in multilayer ceramic substrates.

Abstract: This invention concerns method and apparatus for making a mask conforming to a cured MLC substrate. The mask when made may be used to add layers of metallization to the cured substrate by conventional photolithographic techniques. The method and apparatus feature use of the cured substrate itself to pattern the mask. Particularly, the substrate is aligned with the unpatterned mask and the image of the substrate transferred to the mask such that once patterned, the mask may subsequently be realigned with the substrate. In preferred form, a system of notches and grooves are used to align the substrate and mask and a lens system used to transfer the substrate image to the mask. The invention also includes method and apparatus for making an improved MLC substrate. The improvement is characterized by the use of photolithographic techniques to add successive layers of metallization to the cured substrate.

Abstract: An interface between a liquid chromatograph and a mass spectrometer is provided for conducting a liquid stream from the chromatograph to the spectrometer. The stream passes from the chromatograph continuously along a tapered concentrator wire toward the narrow end of the wire. The stream is heated in order to evaporate solvent therefrom and to increase the concentration of the solute therein. When the stream reaches the narrow end of the wire, the vacuum created by the mass spectrometer draws the stream through an elongated capillary tube which has a pointed carrier wire positioned therein. A gap is provided in the tube where the tube and the carrier wire intersect the concentrator wire. The capillary tube is either formed with a reduced diameter at one end adjacent the spectrometer or the carrier wire has a ball of solder at that end in order to partially restrict the flow through the tube.