Abstract: Systems and methods providing actions and communications responsive to real-time events incorporating local, remote and learned information are disclosed. The system includes a cloud application on a cloud server and a premises device at a premises. The premises device has a plurality of sensors coupled to and/or included in the premises device. The cloud application receives signals, status and other information from the premises device. The cloud application also obtains information from third party information sources. The cloud application obtains location and other pertinent information about key persons. The cloud application evaluates actions to take in response to signals, status and information received from the premises device taking into consideration information from the third party information sources and information about key persons.

Abstract: Systems and methods providing actions and communications responsive to real-time events incorporating local, remote and learned information are disclosed. The system includes a cloud application on a cloud server and a premises device at a premises. The premises device has a plurality of sensors coupled to and/or included in the premises device. The cloud application receives signals, status and other information from the premises device. The cloud application also obtains information from third party information sources. The cloud application obtains location and other pertinent information about key persons. The cloud application evaluates actions to take in response to signals, status and information received from the premises device taking into consideration information from the third party information sources and information about key persons.

Abstract: There is disclosed a generalized security system that includes a local system, a mobile device application, and a server that is accessible via the mobile device application and a browser. The local system contains a microprocessor, communications components and related software all of which enable communications with the server and external components coupled with the local system. The local system software and server software combine with the mobile application and website interface to enable a user to monitor, configure, and control security components coupled with the local system and the local system itself via the server. The system replaces multiple disparate control devices with a single, configurable device and system.

Abstract: A semiconductor package with a semiconductor chip having under bump metallizations (UBMs) on a first surface and a substrate having open vias. The substrate is attached to the semiconductor chip with the UBMs in alignment with the open vias. An encapsulant surrounds the semiconductor chip and the substrate and a conductor fills the open vias to form external package connections.

Abstract: A semiconductor package with a semiconductor chip having under bump metallizations (UBMs) on a first surface and a substrate having open vias. The substrate is attached to the semiconductor chip with the UBMs in alignment with the open vias. An encapsulant surrounds the semiconductor chip and the substrate and a conductor fills the open vias to form external package connections. A method of forming a semiconductor package having external package connections includes providing a semiconductor chip having under bump metallizations (UBMs) on a first surface; attaching the first surface of the semiconductor chip to a substrate, the UBMs of the semiconductor chip being in alignment with open vias formed in the substrate; encapsulating the semiconductor chip and the substrate; and filling with open vias with a conductor to form the external package connections.

Abstract: A chemical mechanical polishing (CMP) method is disclosed in which a new polishing pad is broken-in and conditioned into a steady operating state while using a silica (SiO2) based CMP slurry and where the broken-in and conditioned pad is afterwards used for polishing patterned workpieces (e.g., semiconductor wafers) with a ceria (CeO2) based CMP slurry. The approach shortens break-in time and appears to eliminate a first wafer effect usually seen following break-in with ceria-based CMP slurries.

Abstract: A chemical mechanical polishing (CMP) method is disclosed in which a torque-based end-point algorithm is used to determine when polishing should be stopped. The end-point algorithm is applicable to situations where a ceria (CeO2) based CMP slurry is used for further polishing, pre-patterned and pre-polished workpieces (e.g., semiconductor wafers) which have a high friction over-layer (e.g., HDP-oxide) and a comparatively, lower friction and underlying layer of sacrificial pads (e.g., silicon nitride pads). A mass production wise, reliable and consistent signature point in the friction versus time waveform of a torque-representing signal is found and used to trigger an empirically specified duration of overpolish. A database may be used to define the overpolish time as a function of one or more relevant parameters.

Abstract: A chemical mechanical polishing method is disclosed in which a batch of wafers is first supplied to a low-selectivity, first CMP tool for partly polishing the batch with one or more relatively non-selective CMP slurries (e.g., silica (SiO2) based); and in which the batch of partly-polished wafers is subsequently transferred to a higher-selectivity, second CMP tool which uses one or more comparatively more-selective CMP slurries (e.g., ceria (CeO2) based) to further the polishing of the batch of partly-polished wafers and/or to complete the polishing of the partly-polished wafers.

Abstract: A chemical mechanical polishing method is disclosed in which a batch of wafers is first supplied to a low-selectivity, first CMP tool for partly polishing the batch with one or more relatively non-selective CMP slurries (e.g., silica (SiO2) based); and in which the batch of partly-polished wafers is subsequently transferred to a higher-selectivity, second CMP tool which uses one or more comparatively more-selective CMP slurries (e.g., ceria (CeO2) based) to further the polishing of the batch of partly-polished wafers and/or to complete the polishing of the partly-polished wafers.

Abstract: A process for displaying an animated likeness of the face of a character, includes the steps of (a) providing a face screen having a three-dimensional representation of the face of the character; (b) making a projectable image of the face of the character with an image recorder while projecting the image on the face screen with a projector; (c) obtaining a presentation registration of the image and the face screen through a process selected from the group consisting of (i) altering the projectable image, (ii) adjusting at least one component of face screen position, image recording means position, projector position, focal length and lighting while making the projectable image, and (iii) combinations thereof; and (d) subsequently projecting the image on the face screen at the presentation registration whereby an animated likeness of the face of the individual is presented. An apparatus for carrying out the process is also provided.