Abstract: A micro-generator for providing electrical power to a battery charger capable of charging lithium ion, lithium polymer and other rechargeable batteries of the type which power portable electronic devices and MEMS. The micro-generator includes a micro-combustor and a thermoelectric module consisting of a number of quantum well thermoelectric panels connected between spaced heat spreaders, one of which is mounted in thermal communication with the micro-combustor. Different types of hydrocarbon fuel may be supplied to the micro-combustor where it is burned within a combustion chamber. The entire system is controlled in real time by a micro-controller which is powered upon start up by an ultra capacitor and thereafter by the electric power produced by the thermoelectric module.

Abstract: A micro-generator for providing electrical energy to portable electronic devices and MEMS includes a micro-combustor, a micro-turbine connected to the exhaust outlet of the micro-combustor and a thermoelectric module consisting of a number of quantum well thermoelectric panels connected between spaced heat spreaders, one of which is mounted in thermal communication with the micro-combustor. Different types of hydrocarbon fuel may be supplied to the micro-combustor where it is burned within a combustion chamber. The entire system is controlled in real time by a micro-controller which is powered upon start up by an ultra capacitor and thereafter by the electric energy produced by the thermoelectric module and/or the micro-turbine.

Abstract: A micro-generator for providing electrical power to a battery charger capable of charging lithium ion, lithium polymer and other rechargeable batteries of the type which power portable electronic devices and MEMS. The micro-generator includes a micro-combustor and a thermoelectric module consisting of a number of quantum well thermoelectric panels connected between spaced heat spreaders, one of which is mounted in thermal communication with the micro-combustor. Different types of hydrocarbon fuel may be supplied to the micro-combustor where it is burned within a combustion chamber. The entire system is controlled in real time by a micro-controller which is powered upon start up by an ultra capacitor and thereafter by the electric power produced by the thermoelectric module.

Abstract: A micro-generator for providing electrical energy to portable electronic devices and MEMS includes a micro-combustor and a thermoelectric module consisting of a number of quantum well thermoelectric panels connected between spaced heat spreaders, one of which is mounted in thermal communication with the micro-combustor. Different types of hydrocarbon fuel may be supplied to the micro-combustor where it is burned within a combustion chamber. The entire system is controlled in real time by a micro-controller which is powered upon start up by an ultra capacitor and thereafter by electrical energy output from the thermoelectric module.

Abstract: A micro-generator for providing electrical energy to portable electronic devices and MEMS includes a micro-combustor, a micro-turbine connected to the exhaust outlet of the micro-combustor and a thermoelectric module consisting of a number of quantum well thermoelectric panels connected between spaced heat spreaders, one of which is mounted in thermal communication with the micro-combustor. Different types of hydrocarbon fuel may be supplied to the micro-combustor where it is burned within a combustion chamber. The entire system is controlled in real time by a micro-controller which is powered upon start up by an ultra capacitor and thereafter by the electric energy produced by the thermoelectric module and/or the micro-turbine.

Abstract: An electronic device includes a package surrounding at least one integrated circuit, a micro-fluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The micro-fluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electromechanical (MEMs) pump.

Abstract: An electronic device includes a package surrounding at least one integrated circuit, a micro-fluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The micro-fluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electromechanical (MEMs) pump.

Abstract: A ball-grid-array integrated circuit (IC) chip carrier formed from a silicon substrate is disclosed. The silicon ball-grid-array chip carrier is of particular use with ICs having peripheral bond pads which can be reconfigured to a ball-grid-array. The use of a semiconductor substrate such as silicon for forming the ball-grid-array chip carrier allows the chip carrier to be fabricated on an IC process line with, at least in part, standard IC processes. Additionally, the silicon chip carrier can include components such as transistors, resistors, capacitors, inductors and sensors to form a "smart" chip carrier which can provide added functionality and testability to one or more ICs mounted on the chip carrier. Types of functionality that can be provided on the "smart" chip carrier include boundary-scan cells, built-in test structures, signal conditioning circuitry, power conditioning circuitry, and a reconfiguration capability.