Abstract: An electronic device for the sealing of shipping containers is accessible through an RFID system controlled by a microprocessor having an internal memory. The device consists of a small case with a tamper and spoof proof security cable. One end of the cable is permanently attached to the case while the other end is threaded across the center door joint and around the two inner vertical locking rods of the container. The loose end is then inserted and locked into a port on the case, thereby activating the microprocessor. Attempts to access or enter the container through the rear doors will result in severing the cable, causing the time of this event to be logged in the memory of the electronic seal device. A separate electronic reader will access the logged memory of the device, and then transmit the logged data to a central database. The device has a unique and invariant electronic identification number that will be transmitted to a reader on demand.

Abstract: An integrated circuit socket adapted for use with circuits such as dual-in-line packages (DIPs) provides multilevel mounting for such integrated circuits. The socket body is formed to receive the first integrated circuit package while the second integrated circuit package is disposed above the first. Metallic contact members are disposed in holes arranged to coincide with the electrical leads subtending from each circuit. Each contact member is formed with means to receive the coincident electrical leads from the first and second circuits. Each contact member is formed to engage the socket preventing inadvertent removal of the contact member. The contact members are sufficiently long to extend through the socket and an associated printed circuit board to which they may be readily fixed by conventional means. In the one embodiment the socket is unitary and is formed with longitudinal protruding spacer members to separate it from the circuit board. In a second embodiment the socket is modular.

Abstract: An integrated circuit socket particularly directed towards dual-in-line package (DIP) type circuits provide multilevel mounting for such integrated circuits. the socket body is formed to receive the first circuit package while the second circuit package is disposed above the first. Metallic contact members are disposed in holes arranged to coincide with the electrical leads subtending from each circuit. Each contact member is formed with means to clean and receive the coincident electrical leads from the first and second circuits. Insertion of the leads into the contact member scrapes surface dirt and corrosion from the lead to insure metal to metal contact. Each contact member is formed to engage the socket preventing inadvertent removal of the contact member. The contact members are sufficiently long to extend through the socket and an associated printed circuit board to which they may be readily soldered by conventional means.