Patents by Inventor Richard Goin

Richard Goin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070085881
    Abstract: A micro-fluid ejection head structure having multiple arrays of fluid ejection actuators. The structure includes a semiconductor substrate having a first array of fluid ejection actuators for ejecting a first fluid therefrom, and a second array of fluid ejection actuators for ejecting a second fluid therefrom. The first array of fluid ejection actuators is disposed in a first location on the substrate, and the second array of fluid ejection actuators is disposed in a second location on the substrate. A thick film layer having a thickness is attached adjacent the semiconductor substrate. The thick film layer has fluid flow channels formed therein solely for the first array of fluid ejection actuators. A nozzle plate is attached to the thick film layer opposite the semiconductor substrate. The nozzle plate has fluid flow channels formed therein for both the first array of fluid ejection actuators and the second array of fluid ejection actuators.
    Type: Application
    Filed: December 6, 2006
    Publication date: April 19, 2007
    Inventors: Robert Cornell, Richard Goin, James Powers
  • Publication number: 20060218789
    Abstract: A fluid ejector, such as a printhead for an inkjet printer, comprising a substrate that includes a primary via formed therein, and a nozzle member overlying the substrate and including vertical nozzle chambers at least partially overlying the primary via and a corresponding fluid actuator (e.g., a heater) associated with the substrate.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 5, 2006
    Inventors: Richard Goin, Colin Maher, Girish Patil, James Powers
  • Publication number: 20060038851
    Abstract: A micro-fluid ejection head structure having multiple arrays of fluid ejection actuators. The structure includes a semiconductor substrate having a first array of fluid ejection actuators for ejecting a first fluid therefrom, and a second array of fluid ejection actuators for ejecting a second fluid therefrom. The first array of fluid ejection actuators is disposed in a first location on the substrate, and the second array of fluid ejection actuators is disposed in a second location on the substrate. A thick film layer having a thickness is attached adjacent the semiconductor substrate. The thick film layer has fluid flow channels formed therein solely for the first array of fluid ejection actuators. A nozzle plate is attached to the thick film layer opposite the semiconductor substrate. The nozzle plate has fluid flow channels formed therein for both the first array of fluid ejection actuators and the second array of fluid ejection actuators.
    Type: Application
    Filed: August 19, 2004
    Publication date: February 23, 2006
    Inventors: Robert Cornell, Richard Goin, James Powers
  • Publication number: 20050146556
    Abstract: Flow features in an inkjet printhead. The flow features can include a plurality of first channels, each of the plurality of first channels having a first length and positioned to fluidly communicate with an ink reservoir, and each of the plurality of first channels terminating in a first nozzle. The flow features can further include a plurality of second channels, each of the plurality of second channels having a second length greater than the first length and positioned to fluidly communicate with the ink reservoir, each of the plurality of second channels terminating in a second nozzle, each second nozzle being larger than each first nozzle.
    Type: Application
    Filed: December 31, 2003
    Publication date: July 7, 2005
    Inventors: Richard Goin, James Powers
  • Publication number: 20050088486
    Abstract: An improved ink jet printhead for an ink jet printer and method therefor. The printhead includes a semiconductor substrate containing ink ejection devices. A thick film layer is attached to the substrate. A nozzle plate is attached to the thick film layer. The nozzle plate contains a plurality of ink ejection nozzles corresponding to the ink ejection devices. The printhead contains flow features having a height dimension and a width dimension formed therein for flow of ink to the plurality of ink ejection devices for ejection through the nozzles. At least a portion of the flow feature dimensions for at least one of the nozzles is formed in both the thick film layer and laser ablated in the nozzle plate, wherein the thick film layer contains at least 12% of the flow feature dimensions.
    Type: Application
    Filed: October 28, 2003
    Publication date: April 28, 2005
    Inventors: Richard Goin, Colin Maher, James Powers