Patents by Inventor Richard Graetz

Richard Graetz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10563973
    Abstract: A system is configured to perform metrology on a front surface, a back surface opposite the front surface, and/or an edge between the front surface and the back surface of a wafer. This can provide all wafer metrology and/or metrology of thin films on the back surface of the wafer. In an example, the thickness and/or optical properties of a thin film on a back surface of a wafer can be determined using a ratio of a greyscale image of a bright field light emerging from the back surface of the wafer under test to that of a reference wafer.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: February 18, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Shifang Li, Lena Nicolaides, Paul Horn, Richard Graetz
  • Publication number: 20170278236
    Abstract: A system is configured to perform metrology on a front surface, a back surface opposite the front surface, and/or an edge between the front surface and the back surface of a wafer. This can provide all wafer metrology and/or metrology of thin films on the back surface of the wafer. In an example, the thickness and/or optical properties of a thin film on a back surface of a wafer can be determined using a ratio of a greyscale image of a bright field light emerging from the back surface of the wafer under test to that of a reference wafer.
    Type: Application
    Filed: September 2, 2016
    Publication date: September 28, 2017
    Inventors: Shifang Li, Lena Nicolaides, Paul Horn, Richard Graetz