Abstract: Anti-climbing device for a rail vehicle includes a baffle plate, wherein a plurality of mutually parallel protruding first formations are arranged along a linear path on the baffle plate, and a plurality of mutually parallel protruding second formations are arranged along a linear path on the baffle plate and are orientated normally with respect to the first formations, where the extent of the second formations over the face of the baffle plate is smaller than the extent of the first formations over the face of the baffle plate, and where the first formations, at intersection locations of the formations, each have a recess in which the extent of the first formation is reduced.

Abstract: An integrated circuit device package includes a substrate, at least two integrated circuit dies mounted to the substrate, and a thermally conductive stiffener attached to the substrate to counteract warping of the substrate. The stiffener has a first portion in a thermally conductive relationship with a surface of a first integrated circuit die to provide a first heat dissipation mode for the first integrated circuit die, and has a second portion, different from the first portion, the second portion being configured to provide a second heat dissipation mode, different from the first heat dissipation mode, for a second integrated circuit die. The stiffener may be configured to expose a surface of the second integrated circuit die through an opening in the stiffener. A heat sink may be disposed in a thermally conductive relationship with the second integrated circuit die through the opening in the stiffener.

Abstract: A multi-chip integrated circuit (IC) apparatus includes a substrate, one or more first IC chips mounted on the substrate, and a second IC chip mounted on the substrate. One or more first heat sinks are respectively thermally coupled to the one or more first IC chips. A second heat sink is thermally coupled to the second IC chip. An under side of the second heat sink is located further from the substrate than each of respective one or more top sides of the one or more first heat sinks.

Abstract: A method for assembling at least one stacked substrate package, each stacked substrate package includes binding a laminated base substrate, configured to route interconnections between circuitry on a first surface of the laminated base substrate and circuitry on a second surface of the laminated base substrate, to a surface of a rigid carrier to prevent warping of the laminated base substrate. Each base substrate is coupled to at least one dielectric build-up substrate, which is configured to route integrated interconnections between a top surface and a bottom surface of the dielectric build-up substrate, to the laminated base substrate. At least one integrated circuit die is coupled to the at least one dielectric build-up substrate, and then the carrier is released from the laminated base substrate to form an assembled stacked substrate package. Also, multiple stacked substrate packages may be assembled in parallel on one carrier.

Abstract: Anti-climbing device for a rail vehicle includes a baffle plate, wherein a plurality of mutually parallel protruding first formations are arranged along a linear path on the baffle plate, and a plurality of mutually parallel protruding second formations are arranged along a linear path on the baffle plate and are orientated normally with respect to the first formations, where the extent of the second formations over the face of the baffle plate is smaller than the extent of the first formations over the face of the baffle plate, and where the first formations, at intersection locations of the formations, each have a recess in which the extent of the first formation is reduced.

Abstract: The invention relates to a commitment process for efficiently generating a jointly supported decision.

Abstract: A multi-chip integrated circuit (IC) apparatus includes a substrate, one or more first IC chips mounted on the substrate, and a second IC chip mounted on the substrate. One or more first heat sinks are respectively thermally coupled to the one or more first IC chips. A second heat sink is thermally coupled to the second IC chip. An under side of the second heat sink is located further from the substrate than each of respective one or more top sides of the one or more first heat sinks.

Abstract: The invention relates to a prioritization process for achieving a commonly agreed ranking of a plurality of topics handleable with resources available, the process comprises the following steps of deciding whether a common understanding of a specific topic exists; evaluating that specific topic according to its urgency and importance using only one priority indicator; committing on a commonly shared prioritization, expressed as the priority indicator of that specific topic; and ranking of the plurality of topics based on the committed commonly shared prioritization of each specific topic.

Abstract: The invention relates to a commitment process for efficiently generating a jointly supported decision.

Abstract: A rail vehicle including at least one deformation zone arranged at each end side, where the deformation zone has a collision frame, a multiplicity of deformation elements and two A pillars, where the deformation elements are oriented radially about the front structure of the wagon body and are respectively connected at one of their ends to the wagon body, and where the collision frame connects the ends, facing away from the wagon body, of the deformation elements and is arranged about the front structure of the wagon body in an arcuate manner, and where the two A pillars each extend between the wagon body and the collision frame and are permanently connected to the collision frame.

Abstract: A multi-layer heat-shrinkable tubular sleeve (100) comprises an outer layer (110) and an inner layer (120). The outer layer (110) is arranged around the inner layer (120). The outer layer (110) comprises a partially crystalline thermoplastic material with a major part of partially crystalline thermoplastic material with a crystallinity of more than 60%. The inner layer (120) comprises a partially crystalline thermoplastic material or an elastomeric material.

Abstract: A rail vehicle having an attached deformation zone is presented. The rail vehicle has at least one end transverse beam provided in an end face region and corner pillars arranged substantially vertically and extend from the end transverse beam. The deformation zone is provided at the end face having a front transverse beam arranged parallel to the end transverse beam and spaced therefrom in an end-face direction and at least one force transmission element arranged between the end transverse beam and the front transverse beam. The element transmits longitudinal compressive forces between the end transverse beam and the front transverse beam without plastic deformation up to a defined value and failing when the defined value is exceeded.

Abstract: A rail vehicle including at least one deformation zone arranged at each end side, where the deformation zone has a collision frame, a multiplicity of deformation elements and two A pillars, where the deformation elements are oriented radially about the front structure of the wagon body and are respectively connected at one of their ends to the wagon body, and where the collision frame connects the ends, facing away from the wagon body, of the deformation elements and is arranged about the front structure of the wagon body in an arcuate manner, and where the two A pillars each extend between the wagon body and the collision frame and are permanently connected to the collision frame.

Abstract: A multi-layer heat-shrinkable tubular sleeve (100) comprises an outer layer (110) and an inner layer (120). The outer layer (110) is arranged around the inner layer (120). The outer layer (110) comprises a partially crystalline thermoplastic material with a major part of partially crystalline thermoplastic material with a crystallinity of more than 60%. The inner layer (120) comprises a partially crystalline thermoplastic material or an elastomeric material.

Abstract: A crash module for a rail vehicle includes at least one crash element, which is arranged in front of the vehicle structure. At least one transverse profiled element is provided, which is connected to the at least one crash element and which has a substantially lower compressive strength in the longitudinal direction of the rail vehicle than in the transverse direction.

Abstract: A rail vehicle having an attached deformation zone is presented. The rail vehicle has at least one end transverse beam provided in an end face region and corner pillars arranged substantially vertically and extend from the end transverse beam. The deformation zone is provided at the end face having a front transverse beam arranged parallel to the end transverse beam and spaced therefrom in an end-face direction and at least one force transmission element arranged between the end transverse beam and the front transverse beam. The element transmits longitudinal compressive forces between the end transverse beam and the front transverse beam without plastic deformation up to a defined value and failing when the defined value is exceeded.

Abstract: A crash module for a rail vehicle includes at least one crash element, which is arranged in front of the vehicle structure. At least one transverse profiled element is provided, which is connected to the at least one crash element and which has a substantially lower compressive strength in the longitudinal direction of the rail vehicle than in the transverse direction.