Patents by Inventor Richard Grizzard

Richard Grizzard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
    Patent number: 6767427
    Abstract: A method and apparatus for conditioning a polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge. The method includes providing a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge, wherein the primary edge and the secondary edge are both in contact with the polishing pad, and wherein the primary edge is generally parallel to the secondary edge. The method also includes moving the polishing pad in a forward direction, and pressing the conditioning member against the polishing pad.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: July 27, 2004
    Assignee: Lam Research Corporation
    Inventors: Joseph W. Walters, Emil Kneer, Eric Cooper, Richard Grizzard
  • Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
    Publication number: 20020185223
    Abstract: A method and apparatus for conditioning a polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge. The method includes providing a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge, wherein the primary edge and the secondary edge are both in contact with the polishing pad, and wherein the primary edge is generally parallel to the secondary edge. The method also includes moving the polishing pad in a forward direction, and pressing the conditioning member against the polishing pad.
    Type: Application
    Filed: June 7, 2001
    Publication date: December 12, 2002
    Applicant: Lam Research Corporation
    Inventors: Joseph W. Walters, Emil Kneer, Eric Cooper, Richard Grizzard