Patents by Inventor Richard Grundmüller

Richard Grundmüller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10421683
    Abstract: A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: September 24, 2019
    Assignee: CORNING LASER TECHNOLOGIES GMBH
    Inventors: Helmut Schillinger, Richard Grundmüller
  • Patent number: 8785812
    Abstract: The present invention relates to a device for the treatment of a workpiece, in particular of a substantially flat substrate, comprising a table (2) for supporting the workpiece (5), a flow generation apparatus (6, 11) producing a gas flow (22) on a top face (17.1, 17.2) of the table (2) in a region between the workpiece (5) and the top face (17.1, 17.2) of the table (2), on which gas flow the workpiece (5) is supported during the treatment.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: July 22, 2014
    Assignee: Tel Solar AG
    Inventors: Richard Grundmüller, Johannes Meier, Arthur Büchel
  • Publication number: 20140199519
    Abstract: A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 17, 2014
    Applicant: Corning Laser Technologies GmbH
    Inventors: Helmut Schillinger, Richard Grundmüller