Abstract: Ultrasound transducers and methods of forming ultrasound transducers are provided. An ultrasound transducer can include an acoustic stack including: a dematching layer and a flexible circuit including a nonconductive layer and a conductive material. The conductive material can include a plurality of substantially parallel strips. Adhesive can be provided between the dematching layer and the flexible circuit such that it contacts the strips of conductive material and portions of the nonconductive layer between the strips of conductive material. A plurality of substantially parallel cuts can extend through the dematching layer, through the adhesive and into the nonconductive layer without cutting into the strips of conductive material. The flexible circuit can include a ground area and the strips of conductive material and cuts can be located thereon. The adhesive can encapsulate each strip of conductive material on three surfaces, including a top surface and two sides of each strip.