Patents by Inventor Richard H. Crockett

Richard H. Crockett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for transferring heat to or from a semiconductor wafer using a portion of a process gas
    Patent number: 5443997
    Abstract: A method for heating or cooling a semiconductor wafer in semiconductor processing apparatus is described which comprises directing into contact with a surface of the wafer at least a portion of one or more components of the process gas to transfer heat between the wafer and a wafer support positioned in the apparatus adjacent to the wafer. Method and apparatus are also described for controlling the total flow of process gas through the apparatus and for monitoring the pressure in said apparatus to maintain the desired pressure therein.
    Type: Grant
    Filed: May 13, 1992
    Date of Patent: August 22, 1995
    Inventors: Chiu-Wing Tsui, Richard H. Crockett
  • Apparatus for heating and cooling semiconductor wafers in semiconductor wafer processing equipment
    Patent number: 5248370
    Abstract: A method for heating or cooling a semiconductor wafer in semiconductor processing apparatus is described which comprises directing into contact with a surface of the wafer at least a portion of one or more components of the process gas to transfer heat between the wafer and a wafer support positioned in the apparatus adjacent to the wafer. Method and apparatus are also described for controlling the total flow of process gas through the apparatus and for monitoring the pressure in said apparatus to maintain the desired pressure therein.
    Type: Grant
    Filed: November 7, 1991
    Date of Patent: September 28, 1993
    Assignee: Applied Materials, Inc.
    Inventors: Chiu-Wing Tsui, Richard H. Crockett