Abstract: According to the present invention, a blank of an aluminum alloy is partially cut so as to form several disks maintained in the blank by portions of the remaining uncut aluminum. This results in the disks being supported in the blank during formation of the thin films, yet easily separated from the blank into individual disks after the thin films have been deposited. Therefore, multiple disks can be processed during a single manufacturing step.

Abstract: A method for use in forming thin film patterns in the fabrication of integrated circuits. The method involves depositing a bottom layer of positive photoresist material on a substrate, and forming over the bottom layer, a discrete light-transparent top layer of positive photoresist material which is less solubilized in developer after exposure to light than is the material in the bottom layer. The top and bottom layers are preferably separated by an intermediate layer of a light-transparent polymeric material which is immiscible in the bottom layer and unaffected by the subsequently applied top layer.The composite structure is exposed to a selected pattern of light, e.g., through a mask, and developer for the positive photoresist material is applied to the top and bottom layers. In the case where an intermediate layer is used, the top layer is developed first.