Patents by Inventor Richard H. Immel

Richard H. Immel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5271886
    Abstract: A process and apparatus for rapidly expanding and molding carbon dioxide-impregnated polymer particles is disclosed. The process involves expanding the impregnated particles in a moving stream of pressurized saturated steam or super-heated steam, directing the resulting stream of pre-expanded particles into a mold, and molding the particles into a foamed object. Apparatus suitable for use with the process is also disclosed.
    Type: Grant
    Filed: October 14, 1992
    Date of Patent: December 21, 1993
    Assignee: Arco Chemical Technology, L.P.
    Inventors: William Collom, Dennis Fuller, Joseph Kinslow, Bernard H. Meyer, Richard H. Immel
  • Patent number: 4424177
    Abstract: An article having a relatively lower density polystyrene core and a relatively higher density polystyrene skin is prepared by a method in which a mold is supplied, simultaneously and/or sequentially with electrostatically charged prepuffs of a relatively higher density polystyrene and relatively uncharged low density prepuffs. The walls of the metal mold preferentially attract the electrostatically charged particles. The uncharged lower density prepuffs concentrate at the core. The thus filled mold is subjected to the heating and cooling cycle to provide a molded article having a core with a lower density than the skin.
    Type: Grant
    Filed: October 16, 1981
    Date of Patent: January 3, 1984
    Assignee: Atlantic Richfield Company
    Inventor: Richard H. Immel
  • Patent number: 4035216
    Abstract: A method for bonding expanded polymeric parts without an adhesive. The method comprises wetting the surfaces to be bonded with water or water containing from about 1% to 2% wetting agent, positioning the surfaces to be bonded in a nonmovable abutting relationship, encapsulating the joint formed by the abutting surfaces with a mold, and, while encapsulated, passing high frequency electrical energy therethrough to effectuate a bond.
    Type: Grant
    Filed: April 14, 1976
    Date of Patent: July 12, 1977
    Assignee: ARCO Polymers, Inc.
    Inventor: Richard H. Immel