Abstract: A multiple cell capacitor (200) includes at least first and second capacitor cells (260) and a cell balancing circuit (265) electrically coupled to the first and second capacitor cells (260). Packaging material (280) encloses the first and second capacitor cells (260) and the cell balancing circuit (265). The cell balancing circuit (265) can include, for each capacitor cell (260), a resistor (265) formed electrically in parallel with that capacitor cell (260).

Abstract: An electronic device (220) includes a component (105), such as a microprocessor, that generates heat and an electrochemical capacitor (200) used for thermal management. The electrochemical capacitor (200) has a first region, preferably the perimeter region, including electroactive material (160) and an electrolyte (165) and also has a second region, preferably the inner region, including heat sink material (170). When the component (105) and the electrochemical capacitor (200) are mounted within the device (220), the heat sink material (170) of the capacitor (200) is aligned with the component (105).

Abstract: An electrochemical cell is provided with first (10) and second (11) electrodes and a solid polymer electrolyte (15) disposed therebetween. The solid polymer electrolyte is preferably fabricated by providing a linear powdered polymeric precursor material which is thereafter heated to temperatures sufficient to drive off moisture and in the presence of an electrolyte active species. The electrolyte active species is preferably an acidic electrolyte active species which has the effect of protonating the powdered polymeric precursor material. Electrochemical cells fabricated using these devices demonstrate performance characteristics far better than those available in the prior art.

Abstract: An electrochemical capacitor cell (140) is provided with first and second electrodes (146) (148), and a solid polymer electrolyte (154) is disposed therebetween. The electrodes may either be of the same or different materials and may be fabricated from ruthenium, iridium, cobalt, tungsten, vanadium, iron, molybdenum, hafnium, nickel, silver, zinc, and combinations thereof. The solid polymer electrolyte is in intimate contact with both electrodes, and is made from a polymeric support structure having dispersed therein an electrolyte active species. Also a method of fabricating a biopolar electrochemical charge storage device by assembling at least the first and second bipolar subassemblies together with the second layer of electrode active material for the first bipolar subassembly in direct contact with the first layer of electrode active material for the second bipolar subassembly without a current collector disposed therebetween.

Abstract: An electrochemical cell is provided with a first and second electrode assemblies (10) (11), and an electrolyte (15) disposed therebetween. The electrodes may either be of the same or different materials and may be fabricated from ruthenium, iridium, cobalt, tungsten, vanadium, iron, molybdenum, nickel, silver, zinc, and combinations thereof. The electrode assemblies are fabricated by depositing a layer (16) of a conductive ink adhesive on a surface of a current collecting substrate (12). Thereafter, a layer of powdered active material (18) is impregnated onto the surface of the conductive ink layer.

Abstract: An electrochemical cell is provided with first (10) and second (11) electrodes and a solid polymer electrolyte (15) disposed therebetween. The solid polymer electrolyte is preferably fabricated by providing a linear powdered polymeric precursor material which is thereafter heated to temperatures sufficient to drive off moisture and in the presence of an electrolyte active species. The electrolyte active species is preferably an acidic electrolyte active species which has the effect of protonating the powdered polymeric precursor material. Electrochemical cells fabricated using these devices demonstrate performance characteristics far better than those available in the prior art.

Abstract: An electrochemical cell is fabricated by providing two symmetric electrodes and a solid polymer electrolyte disposed therebetween. The symmetric electrodes, anode and cathode, are made from materials such as ruthenium, iridium, cobalt, zinc, bismuth, cadmium, silver, and oxides thereof. The solid polymer electrolyte is in intimate contact with both the anode and cathode, and is made from a polymeric support structure such as polyvinylalcohol, having dispersed therein a proton conducting electrolyte active species.

Abstract: An alkaline gel electrolyte for an electrochemical cell is based on a polymeric binder of polyvinyl alcohol or polyvinyl acetate. Potassium hydroxide and/or sodium hydroxide is blended into the polymeric binder or matrix, and the resulting solution is used to cast a film that is useful as a gel electrolyte. The hydroxide in the solution is between about 1% to 25% by weight, and the polymer concentration is between about 0.5% to 10% by weight. The resulting gel electrolyte film contains between 10 to 90% water by weight. A nickel or iron porphine modifier may be added in an amount between about 1 to 1000 parts per million. The alkaline gel electrolyte is useful in combination with asymmetric inorganic electrodes to make electrochemical cells, and can also function as a separator. Improved power density and higher cycle life is achieved with the gel electrolyte.

Abstract: A TAB (Tape Automated Bonding) process uses single-layer tapes to form a semiconductor structure. Beam leads on a metal tape are "inner-lead bonded" to a chip. Each chip site on a specially-formed plastic tape has a central portion and a peripheral portion which are bonded to the chip so that the central portion forms a protective cover over the chip and the peripheral portion acts as a support for the beam leads during probe testing, excising and forming operations, etc. The bottom surface of the chip preferably remains uncovered so that it can, if appropriate, be electrically connected to ground or another potential.

Abstract: In one embodiment of the present invention a thick film resistor structure comprising common materials is disclosed. The structure includes a supporting carrier as a base for the thick film resistor arrangement, which comprises a resistive material printed on the carrier, first and second noble metal terminating layers connected to either side of the resistive material, first and second barrier layers respectively connected to the first and second noble metal terminating layers, and first and second conducting layers respectively connected to said first and second barrier layers. The barrier layers are preferably composed of nickel or tungsten, whereas the noble metal terminating layers are preferably composed of silver. The resistive material, being formed between the terminating layers, is electrically connected to said copper conducting layers to form a precise thick film resistor structure whose resistance is measurable between said conducting layers.