Patents by Inventor Richard H. Minetti

Richard H. Minetti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication of circuit packages using solid phase solder bonding
    Patent number: 4332341
    Abstract: A method of forming circuit packages including bonding an electronic component, (10) such as a chip carrier, to a supporting substrate (22). Solid solder preforms (13) are applied to contact members (12) on the component or substrate or both. The preforms are bonded to the contact members by heating to a temperature below the melting point of the solder while applying force to the preforms. The preforms are therefore bonded without melting, and fluxing and cleaning operations may be eliminated. The component can then be bonded to the substrate by the same solid phase technique.
    Type: Grant
    Filed: December 26, 1979
    Date of Patent: June 1, 1982
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: Richard H. Minetti