Patents by Inventor Richard H. Warner
Richard H. Warner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7589518Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: February 11, 2005Date of Patent: September 15, 2009Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Patent number: 7492147Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: July 27, 2007Date of Patent: February 17, 2009Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Patent number: 7330023Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: April 21, 2005Date of Patent: February 12, 2008Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Patent number: 6980012Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: October 2, 2003Date of Patent: December 27, 2005Assignee: Cascase Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Patent number: 6720782Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: October 17, 2002Date of Patent: April 13, 2004Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Publication number: 20040061514Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: October 2, 2003Publication date: April 1, 2004Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Publication number: 20030057979Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: October 17, 2002Publication date: March 27, 2003Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Patent number: 6492822Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: October 30, 2001Date of Patent: December 10, 2002Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Publication number: 20020043981Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: October 30, 2001Publication date: April 18, 2002Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Patent number: 6335628Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: February 13, 2001Date of Patent: January 1, 2002Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Publication number: 20010009377Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: February 13, 2001Publication date: July 26, 2001Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Patent number: 6232788Abstract: A wafer probe station adapted for low-current measurements provides electrically active upper and lower chuck assembly elements where air gaps are provided between a major portion of either a lower or nonlower surface on the upper chuck assembly element and a corresponding conductive surface on or connected to the lower chuck assembly element thereby minimizing leakage currents therebetween. The chuck assembly elements are preferably enclosed by an environment control enclosure having a sidewall portion relative to which the upper chuck assembly element can move laterally. During such movement, the upper chuck assembly remains in constant spacing with a conductive member that laterally surrounds it so as to stabilize electro-magnetic conditions. Concurrently, the sidewall portion is kept motionless relative to the probe holder which keeps contaminants away from the region immediate to the upper chuck assembly element, including any moisture droplets that have condensed during low-temperature testing.Type: GrantFiled: May 9, 1997Date of Patent: May 15, 2001Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Patent number: 5663653Abstract: A wafer probe station adapted for low-current measurements provides electrically active upper and lower chuck assembly elements where air gaps are provided between a major portion of either a lower or nonlower surface on the upper chuck assembly element and a corresponding conductive surface on or connected to the lower chuck assembly element thereby minimizing leakage currents therebetween. The chuck assembly elements are preferably enclosed by an environment control enclosure having a sidewall portion relative to which the upper chuck assembly element can move laterally. During such movement, the upper chuck assembly remain in constant spacing with a conductive member that laterally surrounds it so as to stabilize electromagnetic conditions. Concurrently, the sidewall portion is kept motionless relative to the probe holder which keeps contaminants away from the region immediate to the upper chuck assembly element, including any moisture droplets that have condensed during low-temperature testing.Type: GrantFiled: July 27, 1995Date of Patent: September 2, 1997Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
-
Patent number: 5434512Abstract: A probe station is equipped with an integrated guarding system which facilitates the use of the station for low-current measurements, as well as integrated Kelvin connections to eliminate voltage losses caused by line resistances. The station has a chuck assembly which consists of at least three chuck assembly elements. A first element supports the test device, while an underlying second element acts as a guard to reduce leakage currents. These elements are electrically insulated from each other and from their underlying supporting structure, which is the third element. Ready-to-use, selectively detachable electrical connector assemblies provide for signal and guard connections to the first and second chuck assembly elements, respectively, as well as providing Kelvin connections thereto. The capacitance between the respective chuck assembly elements is extremely low due to the provision of air space as the primary electrical insulator.Type: GrantFiled: May 18, 1994Date of Patent: July 18, 1995Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner, Peter D. Andrews
-
Patent number: 5345170Abstract: A probe station is equipped with an integrated guarding system which facilitates the use of the station for low-current measurements, as well as integrated Kelvin connections to eliminate voltage losses caused by line resistances. The station has a chuck assembly which consists of at least three chuck assembly elements. A first element supports the test device, while an underlying second element acts as a guard to reduce leakage currents. These elements are electrically insulated from each other and from their underlying supporting structure, which is the third element. Ready-to-use, selectively detachable electrical connector assemblies provide for signal and guard connections to the first and second chuck assembly elements, respectively, as well as providing Kelvin connections thereto. The capacitance between the respective chuck assembly elements is extremely low due to the provision of air space as the primary electrical insulator.Type: GrantFiled: June 11, 1992Date of Patent: September 6, 1994Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner, Peter D. Andrews
-
Patent number: 5237267Abstract: A wafer probe station has a wafer-supporting vacuum chuck, together with one or more substrate-supporting auxiliary vacuum chucks having independent vacuum controls for mounting contact substrates and calibration substrates simultaneously with the wafer. A detachable interconnection of the various chucks enables independent replacement of each chuck to accommodate various different chuck types, and also permits the elevations of the respective chuck surfaces to be adjusted relative to each other to compensate for differences in thicknesses between the wafer substrate and the calibration or contact substrates. The invention is especially useful in wafer probe stations equipped with enclosures for controlled-environment testing where a large variety of different wafer chucks must be readily interchangeable for testing under different conditions.Type: GrantFiled: May 29, 1992Date of Patent: August 17, 1993Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Richard H. Warner