Abstract: In one embodiment, an apparatus is provided. The apparatus includes a latching component configured to secure a network component within a chassis of a network device when the apparatus is in a first configuration. The latching component is also configured to allow removal of the network component from the chassis of the network device when the apparatus is in a second configuration. The apparatus also includes a handle component coupled to the latching component. The handle component is accessible from a first face of the network component. The handle component is oriented away from the first face. The handle component is configured to facilitate the removal of the network component from the chassis when the apparatus is in the first configuration. The handle component is also configured to facilitate the insertion of the network component into the chassis when the apparatus is in the second configuration.

Abstract: A spring fastener is provided. The spring fastener includes a spring and a flexible member having a shoulder, a first leg and a second leg. The first leg and the second leg are inserted through the spring along a longitudinal axis of the spring. The spring is retained to the flexible member by the shoulder and at least a portion of the first leg or the second leg. The first leg and the second leg have a retention feature to retain the spring fastener when the first leg and the second leg are inserted through an aperture in a component or a surface. A method of utilizing a spring fastener is also provided.

Abstract: A device to extract a near continuous stream of sample water from a high solids content source for the purpose of delivery to a liquid analyzer or sensor for test or measurement. The device includes a source of compressed air and a source of chemical cleaning agent that are used in a coordinated effort to purge and clean the sampling system to ensure the water stream is maintained over long periods of time without significant human intervention. The device includes a valve to allow compressed air to intermittently be sent backwards through the sampling line to purge to drain an inline strainer of solids that have built up since the previous air purge. Downstream of the air valve another valve is used to introduce cleaning chemical into the sampling system to clean residual buildup downstream of the inline strainer. A debubbler unit is placed between the air valve and the cleaning chemical valve to remove air from the sampling system after it was introduced during the air purge event.

Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.

Abstract: An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.

Abstract: A busbar and connector assembly is provided. The busbar and connector assembly includes a printed circuit board having an attached connector arranged to couple to a first busbar and a second busbar coupled to the connector. The busbar and connector assembly includes the connector arranged to distribute a first portion of current from the first busbar to the printed circuit board and distribute a second portion of the current from the first busbar to the second busbar.

Abstract: An adapter for a communication transceiver is provided. The adapter includes a main body having a first end and opposed second end. The first end of the main body has an OSFP (octal small form factor pluggable) edge connector arranged for electrical and physical connection to an OSFP host connector in an OSFP host port. The main body has a QSFP (quad small form factor pluggable) host connector arranged to receive a QSFP edge connector of a QSFP transceiver through the second end of the main body so that the adapter adapts the QSFP transceiver to an OSFP host. A method of using a communication adapter is also provided.

Abstract: A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.

Abstract: An electronics module is provided. The electronics module includes a housing at least partially enclosing a first printed circuit board configured to couple the electronics module to a connector attached to a second printed circuit board. The electronics module includes a first heat sink disposed along a first surface of the housing and a second heat sink disposed along a second surface of the housing. One or more notches or apertures of the first printed circuit board are proximate to the connector thereby enabling an airflow through the second heat sink along the second surface of the housing to exhaust over a surface of the connector with an airflow through the first heat sink.

Abstract: A busbar and connector assembly is provided. The busbar and connector assembly includes a printed circuit board having an attached connector arranged to couple to a first busbar and a second busbar coupled to the connector. The busbar and connector assembly includes the connector arranged to distribute a first portion of current from the first busbar to the printed circuit board and distribute a second portion of the current from the first busbar to the second busbar.

Abstract: A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.

Abstract: A system may include a fan module and a louver. The fan module includes a first housing, adapted to include a fan in a first orientation. The fan is adapted to cause air to flow into the rear side of the first housing and out of the front side of the first housing. The fan module also includes a key receptacle that is adapted to mate with a first key. The louver includes a second housing that includes a set of slats adapted as a one way valve. The second housing also includes the first key which is adapted to only mate with the key receptacle. The second housing also includes the second key which is adapted to not mate with the key receptacle.

Abstract: A system may include a fan module and a louver. The fan module includes a first housing, adapted to include a fan in a first orientation. The fan is adapted to cause air to flow into the rear side of the first housing and out of the front side of the first housing. The fan module also includes a key receptacle that is adapted to mate with a first key. The louver includes a second housing that includes a set of slats adapted as a one way valve. The second housing also includes the first key which is adapted to only mate with the key receptacle. The second housing also includes the second key which is adapted to not mate with the key receptacle.

Abstract: A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

Abstract: An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.

Abstract: A device to extract a near continuous stream of sample water from a high solids content source for the purpose of delivery to a liquid analyzer or sensor for test or measurement. The device includes a source of compressed air and a source of chemical cleaning agent that are used in a coordinated effort to purge and clean the sampling system to ensure the water stream is maintained over long periods of time without significant human intervention. The device includes a valve to allow compressed air to intermittently be sent backwards through the sampling line to purge to drain an inline strainer of solids that have built up since the previous air purge. Downstream of the air valve another valve is used to introduce cleaning chemical into the sampling system to clean residual buildup downstream of the inline strainer. A debubbler unit is placed between the air valve and the cleaning chemical valve to remove air from the sampling system after it was introduced during the air purge event.

Abstract: A system may include a reversible fan module that creates an airflow. The reversible fan module may include a set of attachment members, disposed on a face of the reversible fan module, that secure the reversible fan module a first orientation or a second orientation. The system may further include a chassis that include a divider that divides an interior region of the chassis into a front compartment and a rear compartment, a window, disposed on the divider, that allows airflow between the front compartment and the rear compartment, a first opening in the chassis that opens the front compartment to a first external region, a second opening in the chassis that opens the rear compartment to a second external region, and a bay that receives the reversible fan module.

Abstract: A compact connector is provided. The compact connector includes a connector body having a first group of one or more pins on a first face of a contact tip and a second group of one or more pins on an opposed second face of the contact tip. The first group of one or more pins engages with a first busbar, and the second group of one or more pins engages with a second busbar, wherein when the connector engages with the busbars the contact tip is disposed between the first and second busbars. A method of using a connector is also provided.