Abstract: A write head has a second pole tip layer, a coil layer and a write coil insulation layer that are planarized at their top surfaces. A thin top insulation layer insulates the top of the coil layer from a yoke portion of the second pole piece which is connected to the second pole tip layer in the pole tip region and connected to a first pole piece layer in a back gap region. In a preferred embodiment the write gap layer extends throughout the yoke region and provides the only insulation between the first pole piece layer and the coil layer. Further, it is preferred that the write coil insulation layer be an inorganic material such as silicon dioxide (SiO2). Several embodiments of the write head are provided along with novel methods of making.

Abstract: A method makes a magnetic head at first, second, third, fourth and fifth regions on a substrate including forming a read sensor material layer in all regions, forming a first capping layer on the read sensor material layer in all regions, removing the first capping layer and the sensor material layer in all regions except the first, second and third regions wherein the first region is definable by a read sensor and the second and third regions abut opposite side edges of the first region, forming a low resistance material lead layer and a second capping layer in the fourth and fifth regions wherein the fourth and fifth regions abut the second and third regions respectively, selectively removing portions of the first capping layer in the second and third regions, selectively removing portions of the read sensor material layer in the second and third regions and portions of the second capping layer in the fourth and fifth regions and forming a high resistance material lead layer in the second, third, fourth and

Abstract: A read/write head is provided with an embedded planar dual coil write structure. The head includes generally parallel shield, shield/pole, and pole layers. The shield/pole layer abuts a generally coplanar planarization layer in one embodiment. A circuitous recess is defined in the shield/pole and planarization layer, spanning the junction twice and encircling a central hub of adjoining shield/pole and planarization layer material. A write structure is located in the recess, with the shield/pole layer, planarization layer, and embedded write structure forming a substantially flat surface for building the pole layer. The write structure includes first and second substantially co-planar multi-turn flat coils, where turns of the first write coil are interspersed with turns of the second write coil. The first and second write coils reside in the circuitous recess, winding around the central hub. An insulating material separates the first and second coils.

Abstract: The back end of an MR sensor and a flux guide are joined by a contiguous self-aligned junction so that a predictable overlap of the flux guide on the back end of the MR sensor can be achieved for optimizing signal flux density in the MR sensor. Lead/longitudinal bias layers for the MR sensor are also joined by a contiguous self-aligned junction to the flux guide for stabilizing the flux guide. By employing a single lift off resist mask the MR sensor and the lead/longitudinal bias layers can be patterned followed by deposition of the flux guide. The flux guide is a bilayer of an insulation material layer and a flux guide material layer. The insulation material layer is sandwiched between the MR sensor and the flux guide material layer and between the lead/longitudinal bias layers and the flux guide material layer. A heat guide or combined flux guide and heat guide may be substituted for the aforementioned flux guide.

Abstract: A new method for making patterned magnetic storage media with magnetic and substantially non-magnetic zones utilizes a selective oxidation processes. Selective oxidation is achieved by subjecting a magnetic layer to an oxygen plasma through voids in a patterned mask. A high resolution patterned mask is made by embossing and reactive ion etch processes. The method is used to fabricate patterned magnetic disks media with alternating magnetic and non-magnetic zones ranging from 10 to 1000 Nanometers in width. Magnetic storage disks produced by this method have high-bit densities, minimal topography and reduced signal noise.

Abstract: A method is provided for providing extra insulation between lead layers and first and second shield layers of a read head so as to prevent electrical shorting therebetween. A sensor layer is partially formed with a capping layer of a first oxidizable metallic layer. A lead layer is formed with a second oxidizable metallic capping layer thereon. A rear edge of the partially completed sensor is then formed followed by formation of an insulation layer which seals the rear edge. The wafer, upon which the components are constructed, is then subjected to an oxygen-based plasma which oxidizes the oxidizable layers with the second oxidizable metallic layers oxidizing at a faster rate than the first oxidizable metallic layer. The second oxidized layer then provides the desired extra insulation between the lead layers and the second shield layer. The read head produced by the method includes a sensor layer and first and second lead layers.

Abstract: An MR read head has first and second lead layers protected by first, second and third insulation layers in addition to the first and second insulative gap layers substantially all the way from the side edges of an MR sensor to terminals. The first and second insulation layers do not extend outside of the first and second lead layer sites so that greater heat dissipation can be realized from the MR sensor. Each lead layer comprises first and second lead layer films. Where these films overlap for electrical connection their top and bottom surfaces are protected by the first and second insulation layers and their edges are protected by the third insulation layer. Where the first lead layer film extends from the second lead layer film toward the respective terminal its bottom surface is protected by the first insulation layer and its top surface and its side edges are protected by the third insulation layer. Only three masks are required for fabricating or constructing these components.

Abstract: A method for modifying a substrate surface, including the step of applying a high density plasma to the substrate surface in the presence of a hydrofluorocarbon gas and a carrier gas to form an antiwetting layer on the substrate surface. Optionally, the method including a cleaning step of contacting the slider surface with a carrier gas for a period of time effective to clean the surface.

Abstract: A method is provided for making a well-defined, highly-predictable chevron type MR sensor for a read head. A first material is selected for a first gap layer. A selected second material is deposited on the first gap layer followed by a resist frame that has elongated openings exposing elongated top portions of the first gap layer that extend at an acute angle to a head surface of the read head. A selected reactive ion etch (RIE) is employed to etch away the exposed portions of the second material layer down to the first material of the first gap layer. The material of the second material layer is chosen to be etched by the RIE while the material of the first gap layer is chosen not to be etched by the RIE. An example is Al.sub.2 O.sub.3 for the first gap layer, SiO.sub.2 for the second material layer and a RIE that is fluorine based. The resist frame is removed leaving elongated strips of the second material layer extending at the aforementioned angle to the head surface.

Abstract: A thin film inductive write head has minimal organic insulation material in contact with the encapsulating overcoat. The process for its fabrication includes a reactive ion etching (RIE) process to remove the organic insulative material while still allowing the head top pole piece to be planar. The organic insulation material is removed by RIE down to the head gap layer in the region between the ABS and the coil. The etching is done with the top or second pole piece acting as a mask so that the planarized organic insulation material is still maintained over the portion of the coil that is located between the two pole pieces. Thus the organic insulation material is still present in this region as the planarization layer onto which the ferromagnetic layer for the second pole piece was deposited.

Abstract: A combined read head and write head includes at least one write coil layer embedded in an insulation stack. The insulation stack is sandwiched between first and second pole piece layers that are connected at a back gap. The pole piece layers have first and second pole tips that have edges that form a portion of an air bearing surface. A write gap layer that forms a portion of the air bearing surface is sandwiched between a top surface of the first pole tip and a bottom surface of the second pole tip. A non-magnetic electrically conductive layer on top of the second pole tip forms a portion of the air bearing surface. A magnetoresistive sensor is sandwiched between first and second gap layers, which are sandwiched between first and second shield layers. The second shield layer is a common layer with the first pole piece layer.

Abstract: A method of patterning a ceramic slider by plasma etching is disclosed. The ceramic slider contains alumina and titanium carbide. The method includes the steps of forming an etch pattern by depositing and developing a photoresist on the ceramic slider, and reactive ion etching a first surface on the ceramic slider using an etchant gas. The etchant gas generally includes argon, and a fluorine containing gas. The power source density, during etching ranges from about 0.5 W/(cm.sup.2) to 8 W/(cm.sup.2). Another aspect of the invention is a ceramic slider resulting from the method of the invention having a smoothness ranging from about 20 to 300 .ANG. as measured by atomic force microscopy.

Abstract: A method is provided wherein first and second sacrificial layers of a write element in a merged magnetic head are provided on top of a coil material layer, wherein the first sacrificial layer serves as a mask for shaping the coil material layer into a write coil, and the second sacrificial layer is employed for patterning the desired shape of the first sacrificial layer. The second sacrificial layer is shaped by a first reactive ion etching (RIE) step through a spiral opening in a photoresist layer. The result is a spiral-shaped second sacrificial layer that is employed as a mask for a second RIE to etch the first sacrificial layer through a spiral opening in the second sacrificial layer.

Abstract: A method is provided for providing extra insulation between lead layers and first and second shield layers of a read head so as to prevent electrical shorting therebetween. A sensor layer is partially formed with a capping layer of a first oxidizable metallic layer. A lead layer is formed with a second oxidizable metallic capping layer thereon. A rear edge of the partially completed sensor is then formed followed by formation of an insulation layer which seals the rear edge. The wafer, upon which the components are constructed, is then subjected to an oxygen-based plasma which oxidizes the oxidizable layers with the second oxidizable metallic layers oxidizing at a faster rate than the first oxidizable metallic layer. The second oxidized layer then provides the desired extra insulation between the lead layers and the second shield layer. The read head produced by the method includes a sensor layer and first and second lead layers.

Abstract: An MR read head has first and second lead layers protected by first, second and third insulation layers in addition to the first and second insulative gap layers substantially all the way from the side edges of an MR sensor to terminals. The first and second insulation layers do not extend outside of the first and second lead layer sites so that greater heat dissipation can be realized from the MR sensor. Each lead layer comprises first and second lead layer films. Where these films overlap for electrical connection their top and bottom surfaces are protected by the first and second insulation layers and their edges are protected by the third insulation layer. Where the first lead layer film extends from the second lead layer film toward the respective terminal its bottom surface is protected by the first insulation layer and its top surface and its side edges are protected by the third insulation layer. Only three masks are required for fabricating or constructing these components.

Abstract: The back end of an MR sensor and a flux guide are joined by a contiguous self-aligned junction so that a predictable overlap of the flux guide on the back end of the MR sensor can be achieved for optimizing signal flux density in the MR sensor. Lead/longitudinal bias layers for the MR sensor are also joined by a contiguous self-aligned junction to the flux guide for stabilizing the flux guide. By employing a single lift off resist mask the MR sensor and the lead/longitudinal bias layers can be patterned followed by deposition of the flux guide. The flux guide is a bilayer of an insulation material layer and a flux guide material layer. The insulation material layer is sandwiched between the MR sensor and the flux guide material layer and between the lead/longitudinal bias layers and the flux guide material layer. A heat guide or combined flux guide and heat guide may be substituted for the aforementioned flux guide.

Abstract: A method for making a merged thin film read/write head, where the first pole piece includes a pedestal or pole tip portion that extends up from the first pole piece layer, uses electroplating to form the gap so that the gap layer does not have to be removed later. After the first pole piece is deposited, the coil insulation structure is built over the first pole piece. Afterwards an electrically conductive seed layer of the same ferromagnetic material as the first pole piece is formed over the wafer to provide an electrically conductive path for subsequent electroplating. After the seed layer deposition, a photoresist pattern is then formed to define the shape of the second pole piece. Nonmagnetic nickel-phosphorous is then electroplated onto the seed layer in the region not covered by the photoresist pattern to form the gap layer. The second ferromagnetic layer is then electroplated onto the gap layer to define the shape of the second pole piece.

Abstract: The back end of an MR sensor and a flux guide are joined by a contiguous self-aligned junction so that a predictable overlap of the flux guide on the back end of the MR sensor can be achieved for optimizing signal flux density in the MR sensor. Lead/longitudinal bias layers for the MR sensor are also joined by a contiguous self-aligned junction to the flux guide for stabilizing the flux guide. By employing a single lift off resist mask the MR sensor and the lead/longitudinal bias layers can be patterned followed by deposition of the flux guide. The flux guide is a bilayer of an insulation material layer and a flux guide material layer. The insulation material layer is sandwiched between the MR sensor and the flux guide material layer and between the lead/longitudinal bias layers and the flux guide material layer. A heat guide or combined flux guide and heat guide may be substituted for the aforementioned flux guide.

Abstract: A method for providing a thin film metallization area on a substrate is disclosed comprising the steps of: depositing a Ta adhesion layer on the surface of the substrate seed layer, conducting a photo resist process on the Ta adhesion layer to define the thin film metallization area, including a remnant removal process to remove remnant photo resist process material in the thin film metallization area to the Ta adhesion layer, the Ta adhesion layer preventing the remnant removal from reaching the seed layer, conducting a Ta removal reactive-ion-etch process to remove the Ta adhesion layer in the thin film metallization area, so that the seed layer is exposed in the metallization area. A metal material may then be deposited in the metallization area.

Abstract: A method is described for making a merged thin film read/write head where a common layer serves as both a magnetic shield for the magentoresistive read element and the first pole piece for the inductive write element, and where the first pole piece thus includes a pedestal pole tip portion that extends up from the first pole piece layer. During fabrication a nonmagnetic spacer layer is deposited over the second pole tip and the gap layer, and then reactive ion etching (RIE) removes the spacer layer from the top of the second pole tip and the gap layer not beneath the second pole piece, but leaves the spacer layer on the sidewalls of the second pole tip. The ion bombardment of the RIE process is perpendicular to the gap layer and is continued after removal of the spacer layer to also remove the gap layer in the region not beneath the second pole piece so that the first pole piece layer is exposed.