Patents by Inventor Richard Hyde

Richard Hyde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10719645
    Abstract: A computer-based model having executable semantics may be used to simulate the behavior of a system. A substructure of interest is sliced from the model and analyzed to determine a transformation of the slice while preserving some context of the model. The transformed slice may be further manipulated outside of the model, integrated back into the model in place of the original slice, or used in other ways.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: July 21, 2020
    Assignee: The MathWorks, Inc.
    Inventors: Fu Zhang, Zhi Han, Pieter J. Mosterman, William J. Aldrich, Ebrahim Mehran Mestchian, Denizhan N. Alparslan, Richard Hyde
  • Patent number: 10423884
    Abstract: Methods and devices for providing and using a technical computing environment (TCE) for receiving a TCE model that, when executed, simulates behavior of a dynamic physical system, and that represents one or more physical components and their respective reliability information in a block diagram model. Applications of the model include automated system-level datasheet and bill of materials generation, component reliability information discovery, fault and stress assertions, and identification of emergent faults.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: September 24, 2019
    Assignee: The MathWorks, Inc.
    Inventors: Richard Hyde, Ebrahim M. Mestchian
  • Publication number: 20160357895
    Abstract: Methods and devices for providing and using a technical computing environment (TCE) for receiving a TCE model that, when executed, simulates behavior of a dynamic physical system, and that represents one or more physical components and their respective reliability information in a block diagram model. Applications of the model include automated system-level datasheet and bill of materials generation, component reliability information discovery, fault and stress assertions, and identification of emergent faults.
    Type: Application
    Filed: June 2, 2016
    Publication date: December 8, 2016
    Applicant: The MathWorks, Inc.
    Inventors: Richard Hyde, Ebrahim M. Mestchian