Patents by Inventor Richard I. Roser

Richard I. Roser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLEXIBLE ASSEMBLIES WITH INTEGRATED THERMOELECTRIC MODULES SUITABLE FOR USE IN EXTRACTING POWER FROM OR DISSIPATING HEAT FROM FLUID CONDUITS
    Publication number: 20110000516
    Abstract: In one exemplary embodiment, an assembly includes one or more thermoelectric modules, a compliant thermal interface, and a heat spreader. The compliant thermal interface is configured such that it may substantially conform against and intimately thermally contact an outer surface of a fluid conduit. The heat spreader is disposed generally between and thermally coupled to the compliant thermal interface and the one or more thermoelectric modules. The heat spreader may have greater flexibility than the one or more thermoelectric modules. The heat spreader may also have a thermal conductivity greater than the compliant thermal interface. The assembly may have sufficient flexibility to be circumferentially wrapped at least partially around a portion of the fluid conduit's outer surface, with the compliant thermal interface in substantial conformance against and in intimate thermal contact with the fluid conduit's outer surface portion.
    Type: Application
    Filed: August 2, 2010
    Publication date: January 6, 2011
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Richard I. Roser, Robert Michael Smythe
  • Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits
    Patent number: 7765811
    Abstract: In one exemplary embodiment, an assembly includes one or more thermoelectric modules, a compliant thermal interface, and a heat spreader. The compliant thermal interface is configured such that it may substantially conform against and intimately thermally contact an outer surface of a fluid conduit. The heat spreader is disposed generally between and thermally coupled to the compliant thermal interface and the one or more thermoelectric modules. The heat spreader may have greater flexibility than the one or more thermoelectric modules. The heat spreader may also have a thermal conductivity greater than the compliant thermal interface. The assembly may have sufficient flexibility to be circumferentially wrapped at least partially around a portion of the fluid conduit's outer surface, with the compliant thermal interface in substantial conformance against and in intimate thermal contact with the fluid conduit's outer surface portion.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: August 3, 2010
    Assignee: Laird Technologies, Inc.
    Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Richard I. Roser
  • FLEXIBLE ASSEMBLIES WITH INTEGRATED THERMOELECTRIC MODULES SUITABLE FOR USE IN EXTRACTING POWER FROM OR DISSIPATING HEAT FROM FLUID CONDUITS
    Publication number: 20090000309
    Abstract: In one exemplary embodiment, an assembly includes one or more thermoelectric modules, a compliant thermal interface, and a heat spreader. The compliant thermal interface is configured such that it may substantially conform against and intimately thermally contact an outer surface of a fluid conduit. The heat spreader is disposed generally between and thermally coupled to the compliant thermal interface and the one or more thermoelectric modules. The heat spreader may have greater flexibility than the one or more thermoelectric modules. The heat spreader may also have a thermal conductivity greater than the compliant thermal interface. The assembly may have sufficient flexibility to be circumferentially wrapped at least partially around a portion of the fluid conduit's outer surface, with the compliant thermal interface in substantial conformance against and in intimate thermal contact with the fluid conduit's outer surface portion.
    Type: Application
    Filed: August 23, 2007
    Publication date: January 1, 2009
    Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Richard I. Roser