Abstract: A tire treatment composition including a solid material suspended in a liquid carrier. The solid material consists of at least one ceramic fiber component and a blend of polymeric fibers. The polymeric fibers include various mixtures of polyethylene and/or polypropylene, polyester, polymeric acrylic, and nylon. The solid material may also include a cellulosic fiber. The liquid carrier includes a solution of water and at least one glycol such as ethylene glycol, diethylene glycol, propylene glycol, triethylene glycol, dipropylene glycol, or tetraethylene glycol. The liquid carrier may also include additive agents such as antimicrobial agents, anti-corrosion agents, thickening agents, buffering agents, and adjuvant agents. The tire treatment composition of the present invention is suitable for use with a tire pressure management system or with nitrogen tire pressure systems and is supplied in a volume sufficient in a unit for treatment of the tires of a vehicle.

Abstract: A process for plating a tin-lead alloy on a substrate by displacement plating from an immersion plating solution containing dissolved tin and lead. The process includes the steps of pretreatment of a substrate by contact with a solution containing a pH adjustor for said immersion deposition solution followed by contact of the substrate with said immersion plating solution for a time sufficient to deposit an alloy of tin and lead.

Abstract: An acid solution for displacement plating of a reflowable tin lead alloy having a melting point not exceeding 500.degree. F. over a cupreous surface. The displacement plating solution contains stannous ions in an amount of from 0.05 to 0.50 moles per liter, plumbous ions in an amount of from 0.01 to 0.15 moles per liter, a total content of stannous ions and plumbous ions in an amount of from 0.05 to 0.60 moles per liter and a ratio of stannous ions to plumbous ions varying from about 1.0:3.0 to 50.0:1.0. The solution is characterized by an ability to plate the tin lead alloy at a plating rate of at least 100 microinches per 15 minutes. The deposit obtained is capable of reflow and is useful in the manufacture of printed circuit boards.

Abstract: An acid solution for displacement plating of a reflowable tin lead alloy having a melting point not exceeding 500.degree. F. over a cupreous surface. The displacement plating solution contains stannous ions in an amount of from 0.05 to 0.50 moles per liter, plumbous ions in an amount of from 0.01 to 0.15 moles per liter, a total content of stannous ions and plumbous ions in an amount of from 0.05 to 0.60 moles per liter and a ratio of stannous ions to plumbous ions varying from about 1.0:3.0 to 50.0:1.0. The solution is characterized by an ability to plate the tin lead alloy at a plating rate of at least 100 microinches per 15 minutes. The deposit obtained is capable of reflow and is useful in the manufacture of printed circuit boards.