Abstract: Circuits, methods, and apparatus that provide pressure sensor devices where pressure sensors may be reliably attached to surfaces in device packages, and where the coefficients of expansion of the pressure sensor and the surface are at least approximately equal. Examples may provide pressure sensor devices where pressure sensors may be reliably attached to surfaces in device packages by providing interposers formed to prevent adhesives used to attach the pressure sensors to surfaces from blocking or encroaching into pressure sensor openings or cavities. These same features may be used to accurately locate a pressure sensor relative to the interposer. Embodiments of the present invention may provide pressure sensor devices where the coefficients of expansion of the pressure sensor and the surface are at least approximately equal by proving interposers that are formed of the same or similar material as the pressure sensors, such as silicon.

Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.

Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.

Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.

Abstract: A capacitive pressure sensor (10) utilizes a diaphragm (38) that is formed along with forming gates (56,57) of active devices on the same semiconductor substrate (11).

Abstract: A capacitive pressure sensor (10) utilizes a diaphragm (38) that is formed along with forming gates (56,57) of active devices on the same semiconductor substrate (11).

Abstract: An electronic component includes a support substrate (101), a fixed electrode (113) overlying the support substrate (101), a movable electrode (123, 423) overlying the support substrate and the first electrode (113) wherein the first and second electrodes (113, 123, and 423) form a capacitor with a sensing area, an anchor (122, 422) coupled to the support substrate (101), and beams (125, 425) coupling different attachment points (129) of the second electrode (123, 423) to the anchor (122, 422) wherein the different attachment points (129) form a simply connected polygon and wherein a portion of the sensing area is located within the simply connected polygon.

Abstract: An electronic component includes a substrate (201) with a surface (202), a resistor structure (210) supported by the substrate, and a passivation layer (300, 805) over the resistor and the surface of the substrate where the passivation layer has a hole (311, 312, 611, 612, 613, 614, 711, 811), where the surface of the substrate has a compressive portion and a tensile portion, and where the resistor is located between the compressive and tensile portions of the surface.

Abstract: A method for damping an optical fiber on a bias optical phase modulator having two optical fiber leads comprises the steps of securing the bias phase modulator, applying a silicone or acrylate type of substance to an outward facing surface of the fiber wound on the bias phase modulator means, applying the silicone or acrylate type of substance on the two optical fiber leads for at least 0.5 inch (1.28 cm.) along each lead which is apart from the place where the optical fiber wound on the bias phase modulator, frequently brushing or smoothing out the applied silicone or acrylate type of substance until the substance beings to set, and drying the substance on the optical fiber until the substance is cured. The applied damping material significantly reduces an amplitude of a frequency caused by mechanical vibrations in a rotation sensor.

Abstract: A rotation sensor for sensing rotation, particularly about an axis of a coiled optical fiber, wherein the coiled optical fiber has with light waves propagating in opposite directions in the coiled optical fiber, the phase relationship of the counter-propagating light waves providing a basis for indicating rotation of the sensor. A portion of the coiled optical fiber is a part of and affected by a bias optical phase modulator which causes a varying phase relationship between the light waves at a fundamental frequency. However, the varying phase relation ship has at least one harmonic which is due to mechanical vibration of the optical fiber that is a part of the modulator. This harmonic contributes to an erroneous indication of rotation. The amplitude of such harmonic is reduced by lowering the Q of the resonating fiber. This is effected by applying a damping material to the optical fiber and a portion of the modulator.

Abstract: An error control arrangement for an optical fiber rotation sensor having electromagnetic waves propagating in opposite directions passing through a bias optical phase modulator operated by a phase modulation generator both of which can contribute second harmonic distortion resulting in errors in the sensor output signal which are controlled. Control of the bias optical phase modulator contribution for a modulator having a piezoelectric body wrapped with an optical fiber portion is accomplished by mounting the body utilizing layers having nonlinear stiffness.