Abstract: A low thermal stress package for large area semiconductor dies. The package may include a substrate and at least one pedestal extending from the substrate, wherein the pedestal may have a mounting surface that is smaller than a mounting surface of a semiconductor die that is mounted to the pedestal. The bonded area between the die and the pedestal is therefore reduced relative to conventional semiconductor package substrates, as is the amount of thermal stress sustained by the die during thermal cycling.

Abstract: An electronic power module is disclosed. The module includes a baseplate and a plurality of internally isolated discrete electronic devices mounted to the baseplate such that their electrical leads are oriented away from the baseplate. Electrical leads may be coupled to a printed circuit board (PCB). Other features disclosed include a thermal interface material and an application-specific heat sink. The assembly may be overmolded via injection molding or potted using an encapsulant. Example electronic devices include thyristors, diodes, and transistors.

Abstract: A low thermal stress package for large area semiconductor dies. The package may include a substrate and at least one pedestal extending from the substrate, wherein the pedestal may have a mounting surface that is smaller than a mounting surface of a semiconductor die that is mounted to the pedestal. The bonded area between the die and the pedestal is therefore reduced relative to conventional semiconductor package substrates, as is the amount of thermal stress sustained by the die during thermal cycling.