Patents by Inventor Richard J. Falanga

Richard J. Falanga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4750665
    Abstract: A process for manufacturing combination covers for closing and sealing an electronic package that includes a ceramic lid having a noble metal base frame thick-filmed onto the lid and fired therewith to fuse the base metal to the lid. A gold-tin solder frame is placed over the base frame and bonded thereto to complete the cover.
    Type: Grant
    Filed: November 21, 1986
    Date of Patent: June 14, 1988
    Assignee: Indium Corporation of America
    Inventor: Richard J. Falanga
  • Patent number: 4746583
    Abstract: A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.
    Type: Grant
    Filed: November 21, 1986
    Date of Patent: May 24, 1988
    Assignee: Indium Corporation
    Inventor: Richard J. Falanga