Abstract: A function module using technology which allows conductive vias to be formed in a silicon substrate in order to fabricate three dimensional multifunctional processor system is described. A silicon or other semiconductor carrier having embedded active devices therein is used as a substrate for complex functional elements disposed on both sides thereof. The semiconductor substrate includes conductive vias formed therein which interconnect single chips or multichip modules disposed on either side thereof. Using drilling/plating techniques for wafer substrates electrically interconnected devices are placed on opposite sides of the substrate. Multichip modules (MCM) including the desired functions are then fabricated having input/output (I/Os) connection points which correspond to the vias formed in the substrate.

Abstract: A mechanism for inserting and aligning electronic modules, especially in se configurations, is provided with removable ring or sleeve whereby the module assemblies may be automatically retracted. The removable ring or sleeve is installed near the threaded end of each mounting shaft. When a shaft is unscrewed from the chassis the ring or sleeve bears against a shoulder formed in the end-portion of the module assembly heat sink frame, thereby providing a lifting force on the module assembly. The ring or sleeve is easily installed or removed through an opening in the side of the end-portion.