Patents by Inventor Richard J. Hetherington

Richard J. Hetherington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Zero undercut etch process
    Patent number: 5294520
    Abstract: A process in the fabrication of wiring patterns on ceramic or polymeric substrates precisely controls the cross-sectional dimensions of the metallization that constitute the wiring patterns. A single etch process defines thin film conductors on a substrate without loss to the conductor cross-section and provides enhanced thin film design flexibility. The zero undercut etch process uses photoresists defining the metal patterns to completely protect the metal patterns during the subetch.
    Type: Grant
    Filed: August 25, 1992
    Date of Patent: March 15, 1994
    Assignee: International Business Machines Corporation
    Inventors: Thomas A. DeMercurio, Richard J. Hetherington, Robert A. Meyen, Scott A. Sands
  • Method of fabricating an improved multi-layer ceramic substrate
    Patent number: 4336088
    Abstract: A method of fabricating an improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.
    Type: Grant
    Filed: April 27, 1981
    Date of Patent: June 22, 1982
    Assignee: International Business Machines Corp.
    Inventors: Richard J. Hetherington, George E. Melvin, Stephen A. Milkovich, Ernest N. Urfer
  • Multi-layer ceramic substrate
    Patent number: 4302625
    Abstract: An improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.
    Type: Grant
    Filed: June 30, 1980
    Date of Patent: November 24, 1981
    Assignee: International Business Machines Corp.
    Inventors: Richard J. Hetherington, George E. Melvin, Stephen A. Milkovich, Ernest N. Urfer