Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.

Abstract: A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

Abstract: A method for affixing an RFID tag to sputtering targets is disclosed. A cavity is formed on the back of the backing plate adjacent to the outer edge. Within the cavity, an RFID tag is secured with an encapsulant. The encapsulant is cured with the RFID tag capable of communicating with an associated reader through the encapsulant.

Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.

Abstract: A method for affixing an RFID tag to sputtering targets is disclosed. A cavity is formed on the back of the backing plate adjacent to the outer edge. Within the cavity, an RFID tag is secured with an encapsulant. The encapsulant is cured with the RFID tag capable of communicating with an associated reader through the encapsulant.

Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.

Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.

Abstract: A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

Abstract: An air cavity package includes a dielectric frame that is formed from a polyimide or a liquid crystal polymer (LCP). The dielectric frame is joined to a flange and to electrical leads using a polyimide adhesive.

Abstract: A bond film includes a thermoplastic polyimide adhesive that contains particles which are thermally conductive and electrically conductive particles. A conductive foil layer may be placed between two layers of adhesive to form the bond foil. This bond film has a low curing temperature which reduces CTE mismatch between different substrates and therefore allows direct bonding of substrates that have high coefficient of thermal expansion mismatch. The low curing temperature also allows for reduced processing costs. The conductive bond film does not degrade at high temperatures, allowing for service temperatures up to 350° C. and thermal excursions up to 450° C.

Abstract: Compositions of synthetic diamond particles and their synthesis by homogeneous nucleation of seed particles in the gas phase followed by growth of diamond or diamond-like carbon on these seeds is disclosed. These particles are characterized by their controlled size, shape, purity, surface characteristics, and their electrical properties and crystal structure.