Abstract: A substrate 15 has an electrically adjustable trim pad 50 on the bottom side. A circuit pattern 18 resides on the top side, covered by an RF shield 20. The trim pad is located on the bottom side directly below the RF shield, and is electrically connected 52 to the circuit pattern. A number of surface mount connections 30, typically C5 solder bumps, are located on the bottom side, and surround the trim pad. The trim pad is trimmed after the RF shield is attached, thus providing more accurate tuning of the circuit on the top side.

Abstract: A pad array carrier module for packaging discrete electronic components is provided. A circuit substrate (8) contains component mounting pad pairs (20), each consisting of a power pad (22) and a ground pad (21), on a first side (10). Component mounting pads are electrically connected by circuit traces (23), through conductive vias (14), to terminal solder pads (16) on the second side (12) of the circuit substrate. Some of the ground pads are connected to a common ground solder pad (17). Likewise, some of the power pads are connected to a common supply voltage solder pad (19). Solder spheres (18) are attached to the solder pads. Discrete electronic components (24) are conductively coupled (26) to the component-mounting pad pairs.

Abstract: Photoreactive polymers are treated by exposure to microwave energy. A film of a photoreactive polymer (12), such as a photoresist, is applied to a substrate (10) and selectively exposed to ultraviolet light. The latent image produced is further cured or polymerized by treating the photoresist with microwave energy. Combinations of microwave and thermal energies are also used. The treated photoresist is then developed, producing a sidewall (17) that is vertical, and is improved by reduction of anomolies such as scum or a foot (16) at the base of the resist.