Patents by Inventor Richard J. Lair

Richard J. Lair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of encapsulating an electronic component
    Patent number: 9623591
    Abstract: An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: April 18, 2017
    Assignee: BASF SE
    Inventors: Harold Colwell, Inga Marie Balke, Lee Ann Dombrowski, Richard J. Lair, David M. Lange, Axel Wilms
  • Article having impact resistant surface
    Patent number: 9540972
    Abstract: An article manufactured from a polymeric material filled with fibers has an exterior surface having an impact portion with an arcuate configuration to impart impact resistance to the article. The article also includes a plurality of ribs orientated and configured in a unique manner to also impart impact resistance to the article. The ribs extend from the exterior surface of the article. A fillet having a fillet radius interconnects the ribs and the exterior surface. The fibers of the polymeric material are aligned within the article parallel to a flow of the polymeric material when injected into a mold during a molding process. The ribs are oriented in a pattern relative to the fibers to maximize the impact resistance of the article.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: January 10, 2017
    Assignee: BASF SE
    Inventors: Stephen Hanley, Chul S. Lee, Richard J. Lair, Marianne S. Morgan, Randy Fleck
  • A Method Of Encapsulating An Electric Component
    Publication number: 20150366076
    Abstract: An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.
    Type: Application
    Filed: January 13, 2014
    Publication date: December 17, 2015
    Inventors: Harold Colwell, Inga Marie Balke, Lee Ann Dombrowski, Richard J. Lair, David M. Lange, Axel Wilms
  • ARTICLE HAVING IMPACT RESISTANT SURFACE
    Publication number: 20120251788
    Abstract: An article manufactured from a polymeric material filled with fibers has an exterior surface having an impact portion with an arcuate configuration to impart impact resistance to the article. The article also includes a plurality of ribs orientated and configured in a unique manner to also impart impact resistance to the article. The ribs extend from the exterior surface of the article. A fillet having a fillet radius interconnects the ribs and the exterior surface. The fibers of the polymeric material are aligned within the article parallel to a flow of the polymeric material when injected into a mold during a molding process. The ribs are oriented in a pattern relative to the fibers to maximize the impact resistance of the article.
    Type: Application
    Filed: May 7, 2012
    Publication date: October 4, 2012
    Inventors: Stephen Hanley, Chul S. Lee, Richard J. Lair, Marianne S. Morgan, Randy Fleck