Patents by Inventor Richard J. Mathisen

Richard J. Mathisen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for manufacture of multilayer circuit boards
    Patent number: 5137618
    Abstract: The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques. The method may also be used in single-sided and double-sided circuit board fabrication and for inner layers used in multilayer circuit boards.
    Type: Grant
    Filed: June 7, 1991
    Date of Patent: August 11, 1992
    Assignee: Foster Miller, Inc.
    Inventors: James M. Burnett, Richard J. Mathisen