Abstract: A method to achieve controlled conductivity in microfluidic devices, and a device formed thereby. The method comprises forming a microchannel or a well in an insulating material, and ion implanting at least one region of the insulating material at or adjacent the microchannel or well to increase conductivity of the region.

Abstract: Microfluidic devices and systems having enhanced detection sensitivity, particularly for use in non-fluorogenic detection methods, e.g., absorbance. The systems typically employ planar microfluidic devices that include one or more channel networks that are parallel to the major plane of the device, e.g., the predominant plane of the planar structure, and a detection channel segment that is substantially orthogonal to that plane. The detection system is directed along the length of the detection channel segment using a detection orientation that is consistent with conventional microfluidic systems.

Abstract: A method to achieve controlled conductivity in microfluidic devices, and a device formed thereby. The method comprises forming a microchannel or a well in an insulating material, and ion implanting at least one region of the insulating material at or adjacent the microchannel or well to increase conductivity of the region.

Abstract: The present invention provides multi-layered microfluidic devices comprising an interface layer between every two substrate layers. The interface layer simplifies the manufacturing process of the multi-layered devices because the interface may comprise a material suitable for etching whereby manufacturing of these devices is simplified to a great extent. The invention also provides methods of manufacturing the multi-layered devices wherein the devices may comprise substrates composed of non-similar materials that are bonded together by anodic bonding.

Abstract: The present invention is generally directed to improved methods, structures and systems for interfacing microfluidic devices with ancillary systems that are used in conjunction with such devices. These systems typically include control and monitoring systems (620) for controlling the performance of the processes carried out within the device, e.g., monitoring and controlling environmental conditions and monitoring results of the processes performed, e.g., detection.

Abstract: A test device for use as a fluorescent standard in microfluidic analytical detection systems includes one or more slits that correspond to, and are of similar dimension to, one or more microchannels in a detection region on a corresponding analysis chip. A fluorescent material is attached to the test device on the side opposite the illumination source such that excitation radiation passes through the slit(s), which defines the focal plane of the illumination optics, and impinges on the fluorescent material thereby causing the fluorescent material to fluoresce. By displacing the fluorescent material relative to the focal plane, the intensity of the radiation exciting the fluorescent material is dispersed relative to the intensity of the radiation at the focal plane, and concomitantly the strength of the resulting fluorescent signal is reduced.

Abstract: The present invention is generally directed to improved methods, structures and systems for interfacing microfluidic devices with ancillary systems that are used in conjunction with such devices. These systems typically include control and monitoring systems for controlling the performance of the processes carried out within the device, e.g., controlling internal fluid transport and direction, monitoring and controlling environmental conditions and monitoring results of the processes performed, e.g., detection.

Abstract: Method of fabricating microstructures on a substrate. The method comprises providing a substrate layer having a first surface with a resist layer. First selected regions of the resist layer are exposed to an environment that renders the resist layer more or less soluble in a developer solution. The resist layer is then developed in the developer solution to expose selected regions of the substrate surface. Second selected regions of the resist layer are then exposed to an environment that renders the resist layer more or less soluble in the developer solution by aligning exposure of the second selected regions to the first selected regions. The first selected regions of the substrate surface are etched. Second selected regions of the resist layer are then developed to expose the second selected regions of the substrate surface.

Abstract: Microfluidic devices and systems having enhanced detection sensitivity, particularly for use in non-fluorogenic detection methods, e.g., absorbance. The systems typically employ planar microfluidic devices that include one or more channel networks that are parallel to the major plane of the device, e.g., the predominant plane of the planar structure, and a detection channel segment that is substantially orthogonal to that plane. The detection system is directed along the length of the detection channel segment using a detection orientation that is consistent with conventional microfluidic systems.

Abstract: Microfluidic devices and systems having enhanced detection sensitivity, particularly for use in non-fluorogenic detection methods, e.g., absorbance. The systems typically employ planar microfluidic devices that include one or more channel networks that are parallel to the major plane of the device, e.g., the predominant plane of the planar structure, and a detection channel segment that is substantially orthogonal to that plane. The detection system is directed along the length of the detection channel segment using a detection orientation that is consistent with conventional microfluidic systems.

Abstract: The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space between the substrates during the bonding process.

Abstract: The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space between the substrates during the bonding process.

Abstract: Method of fabricating microstructures on a substrate. The method comprises providing a substrate layer having a first surface with a resist layer. First selected regions of the resist layer are exposed to an environment that renders the resist layer more or less soluble in a developer solution. The resist layer is then developed in the developer solution to expose selected regions of the substrate surface. Second selected regions of the resist layer are then exposed to an environment that renders the resist layer more or less soluble in the developer solution by aligning exposure of the second selected regions to the first selected regions. The first selected regions of the substrate surface are etched.

Abstract: Microfluidic devices are fabricated by fabricating structures that are used to align elements that are to be attached to the devices or tools that are to be used in further fabrication steps on those devices. Elements to be attached include additional substrate layers, external sampling elements, e.g. capillaries, and the like. Preferred alignment structures include wells over which reservoirs are positioned, notches for use with alignment keys to align substrate layers or for receiving additional structural elements, and targets or guide holes for receiving tooling in further fabrication steps.

Abstract: The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space between the substrates during the bonding process.

Abstract: The present invention is generally directed to improved methods, structures and systems for interfacing microfluidic devices with ancillary systems that are used in conjunction with such devices. These systems typically include control and monitoring systems for controlling the performance of the processes carried out within the device, e.g., controlling internal fluid transport and direction, monitoring and controlling environmental conditions and monitoring results of the processes performed, e.g., detection.

Abstract: The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space between the substrates during the bonding process.