Patents by Inventor Richard J. Oram

Richard J. Oram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8262204
    Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: September 11, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David M. Braun, Siddhartha Bhowmik, Swaroop K. Kommera, Richard J. Oram, Phillip G. Rourke, Joshua W. Smith, Christopher C. Aschoff
  • Patent number: 7855151
    Abstract: A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (12). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: December 21, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Swaroop K. Kommera, Siddhartha Bhowmik, Richard J. Oram, Sriram Ramamoorthi, David M. Braun
  • Publication number: 20090096845
    Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 16, 2009
    Inventors: David M. Braun, Siddhartha Bhowmik, Swaroop K. Kommera, Richard J. Oram, Phillip G. Rourke, Joshua W. Smith, Christopher C. Aschoff
  • Publication number: 20090053898
    Abstract: A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (12). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.
    Type: Application
    Filed: August 21, 2007
    Publication date: February 26, 2009
    Inventors: Swaroop K. Kommera, Siddhartha Bhowmik, Richard J. Oram, Sriram Ramamoorthi, David M. Braun
  • Publication number: 20090020511
    Abstract: Embodiments of a method of ablation are disclosed.
    Type: Application
    Filed: July 17, 2007
    Publication date: January 22, 2009
    Inventors: Swaroop K. Kommera, Richard J. Oram, Siddhartha Bhowmik