Patents by Inventor Richard J. Radigan

Richard J. Radigan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit boards having improved adhesion between solder mask and metal
    Patent number: 4713298
    Abstract: A printed circuit board having improved adhesion between solder mask and metal includes a primer film on the metal deposited from an aqueous solution which includes 0.01 to 10% by weight of a carboxyl-containing polymer or copolymer.
    Type: Grant
    Filed: April 17, 1986
    Date of Patent: December 15, 1987
    Assignee: M&T Chemicals Inc.
    Inventors: Paul L. K. Hung, Richard J. Radigan, David S. Rosen
  • Printed circuit boards having improved adhesion between solder mask and metal
    Patent number: 4615950
    Abstract: A printed circuit board having improved adhesion between solder mask and metal includes a primer film on the metal deposited from an aqueous solution which includes 0.01 to 10% by weight of a carboxyl-containing polymer or copolymer.
    Type: Grant
    Filed: March 15, 1985
    Date of Patent: October 7, 1986
    Assignee: M&T Chemicals Inc.
    Inventors: Paul L. K. Hung, Richard J. Radigan, David S. Rosen