Abstract: A metallic foil with improved peel strength is disclosed which has on a surface thereof two superimposed electrodeposited layers, the first layer adjacent to said surface comprising a dusty dendritic deposit comprising a major amount of a first metal and the second layer comprising a metal flash uniformly deposited over said first layer comprising a major amount of a second metal other than said first metal. A method for making such foil is disclosed which comprises (A) electrodepositing a first metal on one surface of said foil to produce a dusty dendritic metal deposit and (B) electrodepositing on the dendritic deposit of (A) a uniform metal flash. The improved foil is useful for a wide range of applications that benefit from the improved bonding to substrates, including electronic applications such as laminated electronic devices, such as printed circuit boards, and solid state switches.