Abstract: A packaged semiconductor device includes a semiconductor die mounted on a leadframe, a housing for the semiconductor die defining a horizontal plane and a horizontal direction. The leadframe includes leads each having an inner lead portion inside the housing and an outer lead portion that includes a first portion that extends out in the horizontal direction from one of the sidewalls of the housing, a transition portion that includes a vertical direction component, and a distal end portion, wherein the distal end portion of the leads are all on the horizontal plane. The outer lead portions alternate between a gull wing lead shape having the distal end portions extending in the horizontal direction outward from the housing and inward extending leads that have their distal end portions extending in the horizontal direction inward toward the housing. The leadframe consists of a single leadframe.

Abstract: A packaged semiconductor device includes a semiconductor die mounted on a leadframe, a housing for the semiconductor die defining a horizontal plane and a horizontal direction. The leadframe includes leads each having an inner lead portion inside the housing and an outer lead portion that includes a first portion that extends out in the horizontal direction from one of the sidewalls of the housing, a transition portion that includes a vertical direction component, and a distal end portion, wherein the distal end portion of the leads are all on the horizontal plane. The outer lead portions alternate between a gull wing lead shape having the distal end portions extending in the horizontal direction outward from the housing and inward extending leads that have their distal end portions extending in the horizontal direction inward toward the housing. The leadframe consists of a single leadframe.

Abstract: A transfer mold compound mixture for use in a transfer mold device to encapsulate electronic components. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound.

Abstract: Circuits and methods of fabricating circuits are disclosed herein. A method of fabricating an electronic circuit includes placing an electronic component on a substrate. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound. The mixed mold compound is applied to the substrate by way of a transfer mold process, wherein the mixed mold compound encapsulates the electronic component.

Abstract: Fabricating a packaged semiconductor device provides first planar leadframe with first leads and pads having attached electronic components. The first leadframe has a set of elongated leads bent at an angle away from the plane of the first leadframe. A second planar leadframe has second leads having attached electronic components. The bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes.

Abstract: Fabricating a packaged semiconductor device provides first planar leadframe with first leads and pads having attached electronic components. The first leadframe has a set of elongated leads bent at an angle away from the plane of the first leadframe. A second planar leadframe has second leads having attached electronic components. The bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes.

Abstract: A semiconductor system (100) has a first planar leadframe (101) with first leads (102) and pads (103) having attached electronic components (120), the first leadframe including a set of elongated leads (104) bent at an angle away from the plane of the first leadframe; a second planar leadframe (110) with second leads (112) and pads (113) having attached electronic components (114); the bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes; and packaging material (140) encapsulating the 3-dimensional network.

Abstract: A semiconductor system (100) has a first planar leadframe (101) with first leads (102) and pads (103) having attached electronic components (120), the first leadframe including a set of elongated leads (104) bent at an angle away from the plane of the first leadframe; a second planar leadframe (110) with second leads (112) and pads (113) having attached electronic components (114); the bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes; and packaging material (140) encapsulating the 3-dimensional network.

Abstract: Circuits and methods of fabricating circuits are disclosed herein. A method of fabricating an electronic circuit includes placing an electronic component on a substrate. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound. The mixed mold compound is applied to the substrate by way of a transfer mold process, wherein the mixed mold compound encapsulates the electronic component.