Abstract: A vertical fuse structure and methods for customization of integrated circuits include a substantially vertically-oriented interconnect structure or “fuse” which provides for a more densely packed and thus smaller programmable integrated circuit. In a preferred embodiment, a vertical interconnect structure is fabricated by forming a first interconnect layer, forming an insulating layer over the first interconnect layer in which substantially vertically-oriented vias are patterned in contact with the first interconnect layer, filling the vias with a conductive plug, and forming a second interconnect layer over the insulating layer in contact with the conductive plug. The vertical interconnect structure is preferably disconnected by forming a narrow, substantially vertical disconnect cavity through the second interconnect layer and a portion of the conductive plug, thereby removing the connection between the second interconnect layer and the plug.

Abstract: A vertical fuse structure and methods for customization of integrated circuits include a substantially vertically-oriented interconnect structure or “fuse” which provides for a more densely packed and thus smaller programmable integrated circuit. In a preferred embodiment, a vertical interconnect structure is fabricated by forming a first interconnect layer, forming an insulating layer over the first interconnect layer in which substantially vertically-oriented vias are patterned in contact with the first interconnect layer, filling the vias with a conductive plug, and forming a second interconnect layer over the insulating layer in contact with the conductive plug. The vertical interconnect structure is preferably disconnected by forming a narrow, substantially vertical disconnect cavity through the second interconnect layer and a portion of the conductive plug, thereby removing the connection between the second interconnect layer and the plug.

Abstract: A method is provided for making re-usable configuration masks by initially patterning a mask blank using precision mask-making tools. The mask is then covered with an opaque material, and desired configuration points for a particular ASIC are selected with a non-precision laser. After the particular configuration pattern is no longer needed, the remaining opaque material is removed. The mask can then be re-configured for a new design by covering the mask with a new layer of opaque material and selecting new configuration points. Such a mask reduces both time and costs for creating a set of mask designs because a single mask can be re-used for several different designs without the further need of precision mask-making tools.