Patents by Inventor Richard J. St-Pierre

Richard J. St-Pierre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8994393
    Abstract: A test device including cobra probes and a method of manufacturing is disclosed. The test device includes a conductive upper plate having an upper guide hole and a conductive lower plate having a lower guide hole. The test device also includes a conductive cobra probe disposed between the upper guide hole of the upper plate and the lower guide hole of the lower plate. A dielectric material insulates the cobra probe from the upper plate and the lower plate.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: March 31, 2015
    Assignee: International Business Machines Corporation
    Inventors: Hanyi Ding, John Ferrario, Barton E. Green, Richard J. St. Pierre
  • Patent number: 8917104
    Abstract: A testing structure, system and method for monitoring electro-migration (EM) performance. A system is described that includes an array of testing structures, wherein each testing structure includes: an EM resistor having four point resistive measurement, wherein a first and second terminals provide current input and a third and fourth terminals provide a voltage measurement; a first transistor coupled to a first terminal of the EM resistor for supplying a test current; the voltage measurement obtained from a pair of switching transistors whose gates are controlled by a selection switch and whose drains are utilized to provide a voltage measurement across the third and fourth terminals. Also included is a decoder for selectively activating the selection switch for one of the array of testing structures; and a pair of outputs for outputting the voltage measurement of a selected testing structure.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: December 23, 2014
    Assignee: International Business Machines Corporation
    Inventors: Fen Chen, Roger A. Dufresne, Kai D. Feng, Richard J. St-Pierre
  • Patent number: 8890556
    Abstract: An integrated circuit, testing structure, and method for monitoring electro-migration (EM) performance. A method is described that includes method for measuring on-chip electro-migration (EM) performance, including: providing a first on-chip sensor continuously powered with a stress current; providing a second on-chip sensor that is powered only during measurement cycles with a nominal current; obtaining a first resistance measurement from the first on-chip sensor and a second resistance measurement from the second on-chip sensor during each of a series of measurement cycles; and processing the first and second resistance measurements.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: November 18, 2014
    Assignee: International Business Machines Corporation
    Inventors: Fen Chen, Roger A. Dufresne, Kai D. Feng, Richard J. St-Pierre
  • Publication number: 20140062519
    Abstract: A test device including cobra probes and a method of manufacturing is disclosed. The test device includes a conductive upper plate having an upper guide hole and a conductive lower plate having a lower guide hole. The test device also includes a conductive cobra probe disposed between the upper guide hole of the upper plate and the lower guide hole of the lower plate. A dielectric material insulates the cobra probe from the upper plate and the lower plate.
    Type: Application
    Filed: September 6, 2012
    Publication date: March 6, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hanyi DING, John FERRARIO, Barton E. GREEN, Richard J. ST. PIERRE
  • Publication number: 20130106452
    Abstract: An integrated circuit, testing structure, and method for monitoring electro-migration (EM) performance. A method is described that includes method for measuring on-chip electro-migration (EM) performance, including: providing a first on-chip sensor continuously powered with a stress current; providing a second on-chip sensor that is powered only during measurement cycles with a nominal current; obtaining a first resistance measurement from the first on-chip sensor and a second resistance measurement from the second on-chip sensor during each of a series of measurement cycles; and processing the first and second resistance measurements.
    Type: Application
    Filed: October 26, 2011
    Publication date: May 2, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Fen Chen, Roger A. Dufresne, Kai D. Feng, Richard J. St-Pierre
  • Publication number: 20130049793
    Abstract: A testing structure, system and method for monitoring electro-migration (EM) performance. A system is described that includes an array of testing structures, wherein each testing structure includes: an EM resistor having four point resistive measurement, wherein a first and second terminals provide current input and a third and fourth terminals provide a voltage measurement; a first transistor coupled to a first terminal of the EM resistor for supplying a test current; the voltage measurement obtained from a pair of switching transistors whose gates are controlled by a selection switch and whose drains are utilized to provide a voltage measurement across the third and fourth terminals. Also included is a decoder for selectively activating the selection switch for one of the array of testing structures; and a pair of outputs for outputting the voltage measurement of a selected testing structure.
    Type: Application
    Filed: August 31, 2011
    Publication date: February 28, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Fen Chen, Roger A. Dufresne, Kai D. Feng, Richard J. St-Pierre