Abstract: A gold nanoporous anodic aluminum oxide (NAAO) substrate used in coordination with a handheld Surface-Enhanced Raman Spectroscopy (SERS) device for detecting phenylalanine (Phe) in a sample collected from a subject, the gold NAAO substrate comprising a multilayered nanoporous aluminum layer; and a gold layer disposed on top of the multilayered nanoporous aluminum layer. The gold layer comprises gold nanoparticles.

Abstract: A method for fabrication of a gold nanoporous anodic aluminum oxide (NAAO) substrate used in coordination with a handheld Surface-Enhanced Raman Spectroscopy (SERS) device for detecting phenylalanine (Phe) in a sample collected from a subject, the method comprising forming a three-phase system on top of a multilayered nanoporous aluminum layer of the gold NAAO substrate; injecting a cosolvent solution into the three-phase system, wherein the cosolvent solution comprises gold nanoparticles; forming a gold layer on top of the multilayered nanoporous aluminum layer, and drying the gold NAAO substrate.

Abstract: Preferred aspects of the present invention provide ammonium nitrate compositions comprising ammonium nitrate and at least one stabilizing agent, and preferably a third compound. In certain preferred embodiments, the stabilizing agent, together with third compound, is present under conditions and in amounts effective to substantially reduce the detonation sensitivity of the composition and/or to otherwise improve a desired property of the composition.

Abstract: Preferred aspects of the present invention provide ammonium nitrate compositions comprising ammonium nitrate and at least one stabilizing agent, and preferably a third compound. In certain preferred embodiments, the stabilizing agent, together with third compound, is present under conditions and in amounts effective to substantially reduce the detonation sensitivity of the composition and/or to otherwise improve a desired property of the composition.

Abstract: Preferred aspects of the present invention provide ammonium nitrate compositions comprising ammonium nitrate and at least one stabilizing agent, and preferably a third compound. In certain preferred embodiments, the stabilizing agent, together with third compound, is present under conditions and in amounts effective to substantially reduce the detonation sensitivity of the composition and/or to otherwise improve a desired property of the composition.

Abstract: Preferred aspects of the present invention provide ammonium nitrate compositions comprising ammonium nitrate and at least one stabilizing agent, and preferably a third compound. In certain preferred embodiments, the stabilizing agent, together with third compound, is present under conditions and in amounts effective to substantially reduce the detonation sensitivity of the composition and/or to otherwise improve a desired property of the composition.

Abstract: A stabilized hydroxylamine solution is disclosed. The stabilized solution comprises a selected stabilizer, which can be added during manufacture and/or storage of the hydroxylamine solution.

Abstract: A multi-wavelength optical communication system includes a number of emitters each of which emits radiation at a different wavelength; a plurality of the detectors each of which senses radiation at a different wavelength corresponding to the radiation from one of the emitters and a shared waveguide including a scattering medium to transmit emitted radiation to the detectors.

Abstract: A semiconductor-based, photo detector device capable of simultaneously detecting two or more selected wavelengths of light on a pixel-registered basis. The device has detector layers of selected semiconductor materials of one micron or less in thickness interspersed with contact layers, each detector layer having a different light absorption to wavelength response curve. All contact layers, including detector bias voltages, have electrical contacts on the backside of the pixel for discrete pixel connection to mating connections on a suitable ROIC substrate. Among its several embodiments, there is a multi-color detector array and a single channel per pixel differential optical signal detector.

Abstract: A stabilized hydroxylamine solution is disclosed. The stabilized solution comprises a selected stabilizer, which can be added during manufacture and/or storage of the hydroxylamine solution.

Abstract: A system to facilitate alignment of an optical connector to respective optical channels of one or more optical arrays. Optical planar arrays having multiple optical emitters and multiple optical detectors of a multi-channel optical link are aligned by employing supporting circuitry and software that controls the optical devices, enabling all receivers, turning on the transmitters sequentially, and recording the optimal transmitter/receiver pairs. Another feature of the invention is the aspect of redundancy, wherein the system establishes a record of spare emitters and spare detectors that are used when the selected transmitter receiver pair degrades or fails. The techniques of the present invention also provide a unique multiplexer/demultiplexer arrangement for a single wavelength channel of emitters and detectors.

Abstract: A fiber optic cable connector including a coupler body with a channel for receiving a connector plug therein; and a door spanning the channel, the door biased to cover the channel but displaceable with respect to the channel when the plug body is received in the channel to prevent light from escaping the channel when the plug body is removed from the channel.

Abstract: An optical array chip (60) is flip-chip bonded to ASIC substrate (50), and electrically connected to its supporting circuitry through compressively joined solder bump sets (57) and (67). Flowable epoxy hardener material (70) is applied to underfill between the surfaces of chip (60) and the ASIC surface, surrounding the bump contact sets and filling a standoff cavity system that had been etched in the electrical interface side of chip (60) to a depth greater than electrical layer (66) of chip (60) by the amount of the pre-determined standoff height, prior to application of its bump contacts. Standoff grid (72) and individual optical devices (69) are exposed after lapping and etching of the optical interface side of chip (60) down to the level of electrical layer (66). The grid structure may have other forms, such as a vertical perimeter standoff ridge surrounding chip (60) or penetrating electrical layer (66), or a distributed pattern of vertical posts or wall sections penetrating electrical layer (66).

Abstract: A tool for removing and installing a golf spike, having a threaded stud and a cleat at one end of the stud, includes a tubular body that surrounds a cavity, pins projecting from an end wall at one end of the body, and an end cap closing the other end of the body. The pins are spaced and otherwise configured to fit into holes that are in the cleat, so that when a torque is applied to the body, it will be transferred to the spike. The cavity contains several replacement spikes. The end cap snaps onto the body, yet has the capacity to rotate on the body.

Abstract: A fiber optic connector including a molded alignment coupler including a base plate, an opening in the base plate, and at least one alignment channel in the base plate. A housing upstanding from base plate surrounds the opening and the one alignment channel; and an insert plate is placed in the housing, the insert plate including an opening etched therethrough corresponding to the opening in the base plate of the coupler, and at least one channel etched in the insert plate corresponding to the alignment channel of the coupler.

Abstract: A tool for removing and installing a golf spike, having a threaded stud and a cleat at one end of the stud, includes a tubular body that surrounds a cavity, pins projecting from an end wall at one end of the body, and an end cap closing the other end of the body. The pins are spaced and otherwise configured to fit into holes that are in the cleat, so that when a torque is applied to the body, it will be transferred to the spike. The cavity contains several replacement spikes. The end cap snaps onto the body, yet has the capacity to rotate on the body.

Abstract: A method for alignment in software and supporting circuitry of the optical transmitters and receivers to their respective optical channels at each connection of a multi-channel optical link to an optical planar array, permits non-critical physical alignment of the connector to the optical array. The steps include: employing a connector and optical array configuration at each connection in which there are several optical devices within the illumination area of each channel at the connector/array interface, employing supporting circuitry and software that has control of all optical devices associated with the optical link, enabling all receivers, turning on the transmitters sequentially, recording which of the receivers is responding, comparing matching receiver sets for each transmitter to identify associated transmitter sets and channels.

Abstract: A fiber optic connector including a molded alignment coupler including a base plate, an opening in the base plate, and at least one alignment channel in the base plate. A housing upstanding from base plate surrounds the opening and the one alignment channel; and an insert plate is placed in the housing, the insert plate including an opening etched therethrough corresponding to the opening in the base plate of the coupler, and at least one channel etched in the insert plate corresponding to the alignment channel of the coupler.

Abstract: In a method for incorporating an optical connector standoff structure in a semiconductor opto-electronic interface apparatus, an optical array chip (60) is flip-chip bonded to ASIC substrate (50), and electrically connected to its supporting circuitry through compressively joined solder bump sets (57) and (67). Flowable epoxy hardener material (70) is applied to underfill between the surfaces of chip (60) and the ASIC surface, surrounding the bump contact sets and filling a standoff cavity system that had been etched in the electrical interface side of chip (60) to a depth greater than electrical layer (66) of chip (60) by the amount of the pre-determined standoff height, prior to application of its bump contacts. Standoff grid (72) and individual optical devices (69) are exposed after lapping and etching of the optical interface side of chip (60) down to the level of electrical layer (66).

Abstract: A fiber optic cable connector including a coupler body with a channel for receiving a connector plug therein; and a door spanning the channel, the door biased to cover the channel but displaceable with respect to the channel when the plug body is received in the channel to prevent light from escaping the channel when the plug body is removed from the channel.