Abstract: The instant invention is directed to an aqueous bath for the electrodeposition of a bright iron-nickel alloy and to a process utilizing the same, the bath comprising iron ions, nickel ions, an iron complexing agent containing at least two complexing groups independently selected from the group consisting of carboxy and hydroxy provided at least one group is a carboxy group, and a reaction product of a polyamine and an alkylating or sulfonating agent, whereby there is achieved a marked improvement in the brightness of the electrodeposit as well as excellent leveling in both the high and low current density areas. Optionally, by the addition of acetylenic brighteners of a particular structural formula even further improved results may be obtained.

Abstract: Substantially improved results by way of durability and appearance are accomplished by electrodepositing upon a metallic substrate a plurality of layers of a nickel-iron alloy, the lowermost of which has a relatively high iron content and the uppermost a relatively lower iron content, upon which is electrochemically bonded a nickel layer and an upper layer of microdiscontinuous chromium or equivalent decorative finishing material.

Abstract: A composite nickel-containing electroplate is formed on a base metal surface by electroplating on the surface an adherent nickel or nickel alloy layer having a thickness of from about 0.15 to 1.5 mils and an average sulfur content of less than about 0.03%. An intermediate nickel or nickel alloy layer, having a thickness of from about 0.005 to 0.2 mils and an average sulfur content of from about 0.05 to 0.3% is then electroplated on the lower layer. An adherent upper nickel or nickel alloy having a thickness of from about 0.2 to 1.5 mils and average sulfur content of from about 0.02 to 0.15% is then electroplated on the intermediate layer, the upper layer containing a lower percentage of sulfur then the lower layer. The source of sulfur, for at least the intermediate layer, is provided by including novel thioethersulfonates of nitriles or amides in the plating bath for that layer.