Patents by Inventor Richard John Murphy

Richard John Murphy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR REDUCING PUNCH-THROUGH DEFECTS
    Publication number: 20120094498
    Abstract: A method for reducing punch-through defects during semiconductor fabrication is disclosed. Various parameters such as partial pressure, total pressure, and temperature are manipulated to reduce punch-through defects, while still maintaining an acceptable etch rate. Some embodiments of the present invention also comprise the use of precursors, such as germane, to achieve faster etch rates with lower etch temperatures.
    Type: Application
    Filed: October 14, 2010
    Publication date: April 19, 2012
    Applicant: International Business Machines Corporation
    Inventors: Abhishek Dube, Eric Chad Toppin Harley, Richard John Murphy